Our standard 16L layers stackup is the most common options selected by most PCB designers. The standard 16 layer stackup can be utilized in most applications for multilayer PCB board. As the standard options, you can get a variable 16 layer stack up from Weller’s engineering suggestion, which is defined by following with 3 options … Continued
Our standard 14L layers stackup is the most common options selected by most PCB designers. The standard 14 layer stackup can be utilized in most applications for multilayer PCB board. As the standard options, you can get a variable 14 layer stack up from Weller’s engineering suggestion, which is defined by following with 3 options … Continued
BOM file is one of necessary documents for PCB board assembly process, except other documents like PCB Gerber file, Pick and Place file, silkscreen file. For PCB designer, it is very important to create an effective BOM file to save time for PCB assembly house to make correct quotation for components and improve efficiency in … Continued
Our standard 10L layers stackup is the most common option selected by most PCB designers. The standard layer stackup can be utilized in most applications. As a standard, you can get a variable 10 layer stack up from Weller’s engineering suggestion, which is defined by following : PCB thickness: 1.3mm/1.6mm/2.0mm/2.4mm/3.0mm Final finished copper thickness: 1/1/1/1/1//1/1/1/1/1oz … Continued
Our standard 8L layers stackup is the most common option selected by most PCB designers. The standard layer stackup can be utilized in most applications. As a standard, you can get a variable 8 layer stack up from Weller’s engineering suggestion, which is defined by following : PCB thickness: 1.0mm/1.6mm/2.0mm/2.4mm/3.0mm Final finished copper thickness: 1/1/1/1/1//1/1/1oz … Continued
The standard 6L layers stackup is the most common option selected by most PCB designers. The standard layer stackup can be utilized in most applications. As a standard, you can get a variable layer stack up from Weller’s engineering suggestion, which is defined by following PCB thickness: 0.7mm/0.8mm/1.0mm/1.6mm/2.0mm/2.4mm/3.0mm Final finished copper thickness: 1/1/1/1/1/oz ( (Note: … Continued
The standard 4L layers stackup is the most common option selected by PCB designers. The standard layer stackup can be utilized in most applications. As a standard option, you can get a variable layer stack up from us, which is defined by following: PCB thickness: 0.5mm/0.8mm/1.0mm/1.6mm/2.0mm/2.5mm/3.0mmFinal finsihed copper thickness: 1/1/1/1oz (Note: the out layer copper … Continued
Thermal management is very crucial in PCB design to transmit the heat of the PCB board with some critical high power components assembled. The four methods of thermal management 1. Thermal Vias,They can be mechanically drilled blind or through vias. 2. Laser, stacked micro-Vias, become more common, especially with low i/o pitch components. 3. Coppr … Continued
More and more PCB designers are interested in impedance track for USB circuit board of 90 ohm impedance. For 90 ohm impedance, there are two options of circuit track to get that: One option is to get 90ohm impedance by single-end impedance track, with stack up as below: The other option is by differential impedance … Continued
When you finish designing a new PCB, congratulate your work. But it is only the half of success as the next importance step is that the design must be facility to be manufacturing. It will get you high cost and poor yield once your design is very “complex” and “high density”. Weller is your ideal … Continued
