Embedded Copper coin and RFI Metal Backed PCB
Thermal management is very crucial in PCB design to transmit the heat of the PCB board with some critical high power components assembled. The four methods of thermal management 1. Thermal Vias,They can be mechanically drilled blind or through vias. 2. Laser, stacked micro-Vias, become more common, especially with low i/o pitch components. 3. Coppr … Continued