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Weller Technology offers an extensive broad arrange of electrical and electromechanical, and PCB (rigid PCB and flex PCB) manufacturing services. These services can include pre-engineering, PCB SMD assembly, PCB PTH assembly,Design for Manufacturability (DFM), Design for Test (DFT), compliance testing, final packaging, and logistics.

Innovation and investment in keeping Weller Technology at the cutting edge helps maintain our position as a professional electronic industry leader.

Our state of the art 4000 square meters electronic assembly facility contains an impressive list of equipment including over 1000 square meters medical clean room. Our assembly capabilities include:

Surface Mount (SMT) Assembly	Through-Hole Assembly
Mixed Technologies challenges	Rigid, Flex, Rigid-Flex PCB assembly
Solder & Washing PCB	AOI Inspection
X-Ray inspection	Functional Testing
Repid Prototyping	Repair Sevice
Conformal Coating: Humiseal-1B73	Potting (by Resin)
Box Build Assembly	Components Sourcing & Logistics

SMT Assembly Capability Review

Components	Resistors, caps, diodes,Sips, Dips, IC, BGA, LED, Connetcors, Headers, some through hole parts, etc.
Components Min x Max (W x L)	(0.254 x 0.13mm ) 01005 – 100 x 45mm (3.94 x 1.77″)
Components Min x Max Height	.005 – 2.00″
PCB Materials	Flex, Rigid-flex, RF, CEM, Aluminum
Solder Paste	Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc. With Alpha brand:ALPHA OM-340
Solder Paste Flux	Lead-free, water soluble, rosin, No-clean, etc.
PCB Min & Max (W x L)	100″ x .100″ min (Pallets) – 30″ x 30″ max
PCB Thickness (Min – Max)	.010″(Fiber) (1mill Flex) min – .500″ max
Paste Inspection	2D, Laser

Radial Insertion

Cycle Rate	22,000
Component Types	Capacitors, resistors, diodes, jumpers, etc.
Hole Span	0.300″min – 0.950″max
Component Body Diameter	0.100″ min – 0.460″ width max
Lead Wire Diameter	0.015’min – 0.032″max
PCB Min x Max (WxL)	2 x 2″” Min – 22′ x 18.5″ Max
Insertable Area (WxL)	20″ x 18.5″
Board Error Correction	BEC feature compensation for PCB pattern errors
Verifier	Expandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials	Flex, Rigid-flex, RF, CEM, Aluminum

DIP (Dual Inline-Pin Package) Insertion

Cycle Rate	4,500
Component Types	.300 Dip & Sockets .600 Dip & Sockets
Compenent Max Size (LxDxH)	0.512″ x 0.512″ x 0.906″
PCB Min x Max (WxL)	2 x 2″ Min – 22′ x 18.5″ Max
PCB Thickness Min x Max	.010 Min – 0.250″ Max
Insertable Area (WxL)	20″ x 18.5″
Board Error Correction	BEC feature compensation for PCB pattern errors
Verifier	Expandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials	Flex, Rigid-flex, RF, CEM, Aluminum

Solder Processing

Solder types	Manual, Mass wave, Seletcive,reflow
Solder metals	Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc.
Flux materials	VOC-free, Lead-free, water soluble, rosin, No-clean, etc.
Fluxing Applicators	Ultra sonic, spray, drop jet, foam, etc.
PCB Min & Max (WxL)	.100 x .100 min (Pallets) – 30″ x 30″ max
PCB Thickness Min – Max	.010″ min – 1″ max
PCB base materials	Flex, Rigid-flex, RF, CEM, Aluminum

AOI Inspection

Inspection Types	3D-X-Ray, AOI Automatic Optical Inspection,
Magnification	255 times
Solder inspection	Color & X-ray
PCB size Min – Max (WxL)	.100″ x.100 min – .30″ x 30″max

Functional Testing

Functional	Burn-in, power up, cycle, etc.
Flying Probe	24 probe, 35″ x 25″max
RF	Synthesized Signal Generator, Frequency Synthesizers, etc.

Firmware programming

System platform	IC type
Windows 10	ST,Ateml,TI…etc

Repair & Upgrade Rework

SMD	Passives (03015 on up), processors, BGA, etc.
Through Hole	Axial, radial, dip, sip, transformers, connetcors, headers, etc.
Cable	Rigid wire, flex circuit, fiber optic, connetcors, etc.
PCB Repair	Trace, via, through hole, smt, etc.

Conmformal Coating

Coating Materials	Acrylic, silicon, UV, etc. DCA200H & AFA200
SCS Precisioncoat spray and despense system	Capable of applying solvent and water based coatings, along with solids with accuracy of 0.001 inches
Minimum/ Maximum Substrate size LxW	2×2″ -20×20″
Maximum Substrate size Height	4″
Coating thickness	25-250 μm (normal: 50um)

Resin Potting

Epoxy Materials

2 part epoxy, Urethane, Silicone, conductive, non-conductive, under fills, etc. 3M-DP270 Epic S7302

Box Build Assembly

Box Build Assembly

Wiring, assembly, testing, labeling, shipping, etc.

Components Procurement

Purchasing	World wide
Component Tacking	100% component & product tracking
Component Guarantee	Hi-Tech sources only top quality components, including single, double and multi-layer boards, semiconductors, active and passive components, and electro-mechanical assemblies

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