PCB Assembly


Weller Technology offers an extensive broad arrange of electrical and electromechanical, and PCB (rigid PCB and flex PCB) manufacturing services. These services can include Engineering, PCB SMD assembly, PCB PTH assembly,Design for Manufacturability (DFM), Design for Test (DFT), compliance testing, final packaging, and logistics. Innovation and investment in keeping Weller Technology at the cutting edge helps maintain our position as a professional industry leader. Our state of the art 4000 square meters electronic assembly facility contains an impressive list of equipment including over 1000 square meters medical clean room. Our assembly capabilities include:

Surface Mount (SMT) Assembly Through-Hole Assembly
Mixed Technologies challenges Rigid, Flex, Rigid-Flex PCB assembly
Solder & Washing PCB AOI Inspection
X-Ray inspection Functional Testing
Repid Prototyping Repair Sevice
Conformal Coating Potting (by Resin)
Box Build Assembly Components Sourcing & Logistics

SMT Assembly Capability Review

ComponentsResistors, caps, diodes,Sips, Dips, IC, BGA, LED, Connetcors, Headers, some through hole parts, etc.
Components Min x Max (W x L)(0.254 x 0.13mm ) 01005 – 100 x 45mm (3.94 x 1.77″)
Components Min x Max Height.005 – 2.00″
PCB MaterialsFlex, Rigid-flex, RF, CEM, Aluminum
Solder PasteLead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc. With Alpha brand:ALPHA OM-340
Solder Paste FluxLead-free, water soluble, rosin, No-clean, etc.
PCB Min & Max (W x L)100″ x .100″ min (Pallets) – 30″ x 30″ max
PCB Thickness (Min – Max).010″(Fiber) (1mill Flex) min – .500″ max
Paste Inspection2D, Laser

Radial Insertion

Cycle Rate22,000
Component TypesCapacitors, resistors, diodes, jumpers, etc.
Hole Span0.300″min – 0.950″max
Component Body Diameter0.100″ min – 0.460″ width max
Lead Wire Diameter0.015’min – 0.032″max
PCB Min x Max (WxL)2 x 2″” Min – 22′ x 18.5″ Max
Insertable Area (WxL)20″ x 18.5″
Board Error CorrectionBEC feature compensation for PCB pattern errors
VerifierExpandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials Flex, Rigid-flex, RF, CEM, Aluminum

DIP (Dual Inline-Pin Package) Insertion

Cycle Rate4,500
Component Types.300 Dip & Sockets .600 Dip & Sockets
Compenent Max Size (LxDxH) 0.512″ x 0.512″ x 0.906″
PCB Min x Max (WxL) 2 x 2″ Min – 22′ x 18.5″ Max
PCB Thickness Min x Max.010 Min – 0.250″ Max
Insertable Area (WxL)20″ x 18.5″
Board Error CorrectionBEC feature compensation for PCB pattern errors
VerifierExpandable range verifier (ERV) ensures operator accuracy of component loading
PCB MaterialsFlex, Rigid-flex, RF, CEM, Aluminum

Solder Processing

Solder types Manual, Mass wave, Seletcive,reflow
Solder metalsLead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc.
Flux materialsVOC-free, Lead-free, water soluble, rosin, No-clean, etc.
Fluxing ApplicatorsUltra sonic, spray, drop jet, foam, etc.
PCB Min & Max (WxL) .100 x .100 min (Pallets) – 30″ x 30″ max
PCB Thickness Min – Max.010″ min – 1″ max
PCB base materials Flex, Rigid-flex, RF, CEM, Aluminum

AOI Inspection

Inspection Types3D-X-Ray, AOI Automatic Optical Inspection,
Magnification255 times
Solder inspectionColor & X-ray
PCB size Min – Max (WxL).100″ x.100 min – .30″ x 30″max

Functional Testing

FunctionalBurn-in, power up, cycle, etc.
Flying Probe24 probe, 35″ x 25″max
RFSynthesized Signal Generator, Frequency Synthesizers, etc.

Firmware programming

System platformIC type
Windows 10ST,Ateml,TI…etc

Repair & Upgrade Rework

SMDPassives (03015 on up), processors, BGA, etc.
Through HoleAxial, radial, dip, sip, transformers, connetcors, headers, etc.
CableRigid wire, flex circuit, fiber optic, connetcors, etc.
PCB RepairTrace, via, through hole, smt, etc.

Conmformal Coating

Coating MaterialsAcrylic, silicon, UV, etc.
DCA200H & AFA200
SCS Precisioncoat spray and despense systemCapable of applying solvent and water based coatings, along with solids with accuracy of 0.001 inches
Minimum/ Maximum Substrate size LxW2×2″ -20×20″
Maximum Substrate size Height4″
Coating thickness25-250 μm (normal: 50um)

Resin Potting

Epoxy Materials2 part epoxy, Urethane, Silicone, conductive, non-conductive, under fills, etc.
3M-DP270
Epic S7302

Box Build Assembly

Box Build AssemblyWiring, assembly, testing, labeling, shipping, etc.

Components Procurement

PurchasingWorld wide
Component Tacking100% component & product tracking
Component GuaranteeHi-Tech sources only top quality components, including single, double and multi-layer boards, semiconductors, active and passive components, and electro-mechanical assemblies