Dear customers, Please kindly have an alert that according to our project experience, we foresee that many ICs will be in very tight supply or even out of stock for a long time, so please schedule your crucial projects of 2021 beforehand.
: For more details, please have an alert to this news, down load Electronic Components Price Increase Reminder_Weller Technology Co., Limited
High-speed (>20Gbps / channel) High Density Highly constrained High-Layer (> 40 layers) 2000+ pin BGA 0.4 mm pitch uBGA Controlled Impedance Backdrill Blind and buried vias HDI Via-in-pad
100% manual routing Improved route density Reduced layer count Minimized via count Reduced PCB cost Effective BGA fanout patterns Layer construction analysis Design partitioning Multiple designers, multiple shifts and multiple sites Constraint-driven design flow Single point of contact Shortened interconnect planning and routing time
Weller PCB’s main focus is delivering the highest quality layout regardless of complexity – from low cost/high volume to high density and mission critical applications.