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High frequency PCB layout

Description
TypeTypical high-end consumer electronic product board
PCB TechnologiesHigh-speed (>20Gbps / channel)
High Density
Highly constrained
High-Layer (> 40 layers)
2000+ pin BGA
0.4 mm pitch uBGA
Controlled Impedance
Backdrill
Blind and buried vias
HDI
Via-in-pad
SRS Features100% manual routing
Improved route density
Reduced layer count
Minimized via count
Reduced PCB cost
Effective BGA fanout patterns
Layer construction analysis
Design partitioning
Multiple designers, multiple shifts and multiple sites
Constraint-driven design flow
Single point of contact
Shortened interconnect planning and routing time
ResultWeller PCB’s main focus is delivering the highest quality layout regardless of complexity – from low cost/high volume to high density and mission critical applications.
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