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IOT Devices PCB Assembly-Embedded Hardware

PCB specification
PCB Layer: 8L
PCB base materials: FR4-Tg170(S1000-2)
Copper thickness: 1OZ
Surface finishing: HAL lead free
Solder mask color: Green
Silkscreen: White Taiyo,PSR4000
Note: RoHS Compliance
HDI with 2+6+2
Complex Mixed impedance control

Assemlby specifiation
Solder paste: Alpha:OM-340
Mixed assembly: DIP+SMT
Confirmal Coating: Yes-DCA200H
Electronical functional test: Yes
Assembly standard: IPC-A-610E
Package: ESD bag
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