20L HDI PCB Layout

Description

Type	Typical high-end consumer electronic product board
PCB Technologies	High-speed (>20Gbps / channel) High Density Highly constrained High-Layer (>20 layers) 2000+ pin BGA 0.4 mm pitch uBGA Controlled Impedance Backdrill HDI Via-in-pad
SRS Features	100% manual routing Improved route density Reduced layer count Minimized via count Reduced PCB cost Effective BGA fanout patterns Layer construction analysis Design partitioning Multiple designers, multiple shifts and multiple sites Constraint-driven design flow Single point of contact Shortened interconnect planning and routing time
Result	Weller PCB’s main focus is delivering the highest quality layout regardless of complexity – from low cost/high volume to high density and mission critical applications.