Rigid PCB Capability

PCB Raw Material

ItemStandardAdvanced
FR4 Standard TgShengyi, ITEQ, KB, NanyaShengyi, ITEQ, KB, Nanya
FR4 Mid Tg (Lead Free Compatible)Shengyi S1000, ITEQ IT158Shengyi S1000, ITEQ IT158
FR4 High Tg
(Lead Free Compatible)
Shengyi S1000‐2, S1170
EMC EM827
Isola 370HR
ITEQ IT180A
Panasonic R1755V
Shengyi S1000‐2, S1170
EMC EM827
Isola 370HR
ITEQ IT180A
Panasonic R1755V
High Performance
Low Loss FR4
EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola I‐Speed, I‐Tera MT
Nelco N4000‐13EP, EPSI
Panasonic R5775 Megtron 6
EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola I‐Speed, I‐Tera MT
Nelco N4000‐13EP, EPSI
Panasonic R5775 Megtron 6
RF MaterialsRogers RO4350, RO3010,RO6003,
Taconic RF‐30, RF‐35,TLC, TLX, TLY
Taconic 601, 602, 603, 605
Rogers RO4350, RO3010
Taconic RF‐30, RF‐35, TLC, TLX, TLY
Taconic 601, 602, 603, 605
Halogen FreeEMC EM-285, EM370(D)
Panasonic R1566
EMC EM-285, EM370(D)
Panasonic R1566
Aluminum Backed PCBShengyi SAR20, Yugu YGA Shengyi SAR20, Yugu YGA

Special Materials

Rigid Polyimide: Shengyi SH260, Ventec VT901
BT Epoxy:  Nelco and Mitsubishi
High CTI FR4: Shengyi S1600
Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi

Surface Finishes

Electroless Nickel Immersion Gold (ENIG): meet IPC-4552
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM

PCB Technology Overview 

ItemStandardAdvanced
Rigid‐Flex & Flexible Circuits YY
Buried and Blind ViasY Y
Sequential LaminationY Y
Single ended impedance50 – 90 ohms +/- 8% but no less than 4 ohm 50 – 90 ohms +/- 5% but no less than 4 ohm
Differential impedance100 – 155 ohms +/- 10% 100 – 155 ohms +/- 10%
Coplanar waveguide impedance 50-90ohms: +/-5 ohm 50-90 ohms: +/-5%
Hybrids & Mixed Dielectrics Y Y
Aluminum or Copper based PCB’s Y Y
Non‐Conductive Via Fill (VIP) YY
Conductive Via FillYY
Cavity BoardsY Y
Back drillingY Y
Controlled Depth Drill and RoutY Y
Edge Plating Y Y
Buried CapacitanceY Y
Etch BackY Y
In‐board Beveling Y Y
2‐D Bar Code PrintingY Y
Maximum Layer Count2036
Maximum Panel Size533x610mm [21×24″]610x1067mm [24×42″]
Outer Layer Trace/Spacing
(1/3oz starting foil + platig)
90µm/90µm
[0.0035″/0.0035″]
64µm/76µm
[0.0025″/0.003″]
Inner Layer Trace/Spacing
(Hoz inner layer cu)
76µm/76µm
[0.003″/0.003″]
50µm/50µm
[0.002″/0.002″
Maximum PCB Thickness3.2mm [0.125″]6.5mm [0.256″]
Minimum PCB Thickness 20mm [0.008″].10mm [0.004″]
Minimum Mechancial Drill Size.20mm [0.008″].10mm [0.004″]
Minimum Laser Drill Size.10mm [0.004″].10mm [0.004″]
Maximum PCB Aspect Ratio 10:1 25:1
Maximum Copper Weight5 oz [178µm]6 oz [214µm]
Minimum Copper Weight1/3 oz [12µm]1/4 oz [9µm]
Minimum Core Thickness50µm [0.002″]38µm [0.0015″]
Minimum Dielectric Thickness64µm [0.0025″]38µm [0.0015″]
Minimum Pad Size Over Drill 0.46mm [0.018″] 0.4mm [0.016″]
Solder Mask Registration± 50µm [0.002″] ± 38µm [0.0015″]
Minimum Solder Mask Dam76µm [0.003″]64µm [0.0025″]
Copper Feature to Edge, V‐cut (30°)0.40mm [0.016″]0.36mm [0.014″]
Copper Feature to PCB Edge, RoutedCopper Feature to PCB Edge, Routed0.25mm [0.010″]0.20mm [0.008″]
Tolerance on Overall Dimensions +/-100µm [0.004″]+/-50µm [0.002″]

Advanced Processes

Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Plating for High Layer Count and Microvias Products
Reverse Pulse Plating
Solid Copper Plated PTH Vias
XACT Tooling System for Improved Layer‐to‐Layer Registration
Spray Coating for Soldermask
Inkjet Printing for Legend
In‐Line AOI for Outerlayers and AOI for Final Inspection
ZETA® Material for HDI and Low‐Loss Applications
ORMET® Copper Paste for Any‐layer Connections

Quality System and Certifications

IPC Specs: IPC‐A‐600, IPC‐6012, IPC‐6013, IPC‐6016 (Class II and
Class III).
Quality System Certifications: ISO 9001:2008, TS16949:2009, ISO13485:
2003
Environmental Certifications: ISO14001:2004, ISO/TS14067:2013
UL Certificated

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