Our standard 12L layers stackup is the most common options selected by most PCB designers. The standard 12 layer stackup can be utilized in most applications for multilayer PCB board.
As a standard option, you can get a variable 12 layer stack up from Weller’s engineering suggestion, which is defined by following :
|Final finished copper thickness:||1/1/1/1/1//1/1/1/1/1/1/1oz (Note: the out layer copper thickness below is base copper thickness)|
|Base material:||Tg170 (Recommend)|
|Remark||The Prepreg thickness could be adjusted according to track distribution|
Above stack up is our standard 12L layer PCB buildup options that upon the best manfuacturing features(quality and price).
We recommend PCB designers to use Tg170 laminate material for multilayer PCB (>= 6 layers) to avoid any potential quality problem during your PCB assembly process: such as layers delamination,blister in lead free assembly process,etc.
Above stack up options is our standard 12L layer buildup with 1/1/1/1/1/1/1/1 oz final finished copper thickness that the upon best manufacturing features for multilayer rigid PCB.