Our standard 8L layers stackup is the most common option selected by most PCB designers. The standard layer stackup can be utilized in most applications.
As a standard, you can get a variable 8 layer stack up from Weller’s engineering suggestion, which is defined by following :
|Final finished copper thickness:||1/1/1/1/1//1/1/1oz (Note: the out layer copper thickness below is base copper thickness)|
|Base material:||Tg170 (Recommend)|
Above stack up is our standard 8L layer PCB buildup that upon the best manfuacturing features(quality and price).We recommend to use Tg170 laminate material for multilayer PCB (>= 6 layers) to avoid any potential quality problem during your PCB assembly process: such as delamination,blister in lead free assembly process,etc.
Above stack up is our standard 8L layer buildup with 1/1/1/1/1/1 oz final finished copper thickness that the upon best manufacturing features for multilayer PCB.
If you need custom stack up or stack up with impedance control at 8L circuit board,or you need 2oz or upper copper thickness PCB stack up, you can send your request to [email protected].