Our standard 8L layers stackup is the most common option selected by most PCB designers. The standard layer stackup can be utilized in most applications.
As a standard, you can get a variable 8 layer stack up from Weller’s engineering suggestion, which is defined by following :
|Final finished copper thickness:||1/1/1/1/1//1/1/1oz (Note: the out layer copper thickness below is base copper thickness)|
|Base material:||Tg170 (Recommend)|
Above stack up is our standard 8L layer PCB buildup that upon the best manfuacturing features(quality and price).We recommend to use Tg170 laminate material for multilayer PCB (>= 6 layers) to avoid any potential quality problem during your PCB assembly process: such as delamination,blister in lead free assembly process,etc.
Above stack up is our standard 8L layer buildup with 1/1/1/1/1/1 oz final finished copper thickness that the upon best manufacturing features for multilayer PCB.