Encapsulation and electronic potting is to encapsulate or fill an electronic assembly with a compound to protect the circuit board and components from corrosion, moisture and chemicals, shock and vibration, contaminants such as dust. Also the potting electronics process can protect the components from security threats, such as reverse engineering and tampering. The typical material of electronic potting and encapsulation including polyurethane, silicone, and epoxy resin, commonly done by automatic equipment (tool) or by manual work with a tool.
WELLER provide one stop solutions from PCB fabrication, Printed circuit board assembly, firmware and testing, box building assembly, and final potting and encapsulation. We can handle any quantity requirement, from first article approval to large quantities production run. Our experts will always help customer to select the ideal coating material for their electronic potting and encapsulation requirements to ensure superior liability and durability. And we will be be pleasure to answer any concerns that you may have. At WELLER solutions, we are your trusted partner for advanced electronic manufacturing, potting and encapsulation services.
Potting and Encapsulation Services Offered:
Weller offer potting and encapsulation for a variety of components. Our additional potting and encapsulation services include:
We also provide free assistance in the design of special housing, enclosure, shells, other casing for your electronic assemblies to add a further level of security. Each assembly we work with is thoroughly inspected and, if necessarily, each cleaned before coating to guarantee uniform adhesion. We also rigorously perform functional testing before and after the potting or encapsulations to ensure the uniform quality.
Electronic Potting and Encapsulation Methods
Except the specific requirement from customer, WELLER offers a variety of alternative materials for your electronic encapsulation and potting requirement needs, including silicone coatings, epoxy coatings, urethane coatings, and, to a lesser extent, acrylic coatings. And there are several alternative materials supplier for your selecting.
Epoxy Coatings
Epoxy coatings are an ideal for protection of harsh environments and physical security, and are tailored to the specific requirement of your application, such as high voltage, thermal concerns, etc.
Silicone Coatings
Silicone potting and silicone encapsulation provide excellent protection against moisture exposure and use a more forgiving material which can protect assemblies from stress and allows for movement.
Urethane Coatings
Urethane coatings also have good performance in extreme environmental conditions, but they aren’t as hard and put less physical stress on the protected assemblies.
Silicone Potting And Encapsulation
Silicone potting and encapsulating processes can provide an even higher level of production to electronic assemblies. The electronic devices encapsulated by this method will have highly resistant to environmental contaminants and even directly pressure cleaning and act us a support or cushion system for LED components package.
Acrylic Coatings
Generally, acrylic coatings are a quick-drying solution for protecting printed circuit board assemblies from moisture and environmental impact.
Electronic Potting and Encapsulation Applications
Not only providing standard electronic potting and encapsulation services, we can support customized potting process to meet customer’s some particular needs. Today, the typical electronic potting and encapsulation applications include but are not limited to:
The Potting & Encapsulation Benefits
Comparing with conformal coating, potting and encapsulation can provide a thicker and more robust on your electronic assemblies from harsher environments, and keep the their reliability and durability properly for longer lengths of time. Below is some typical advantages with electronic potting and encapsulation:
Some Key Considerations for Electronics Encapsulation
Encapsulating and potting PCB assemblies requires a highly experienced expertise to ensure consistent and repeatable results. It must be paid special attention to the procedures to ensure that that resin is applied at the correct temperature, and that correct resin-to-hardener ratio is used to achieve the desired results. Coatings material must also be properly mixed and dispensed to produce a smooth, even coating. Coatings must also be mixed and dispensed properly so as to produce a smooth, even coating.
Our factory develops several unique processes for electronic assemblies potting and encapsulation, and we always keep following latest technique standards to upgrade our production process. For some PCB assemblies only need specific area being coated not complete coating, special tools such as fence & fill application need to be designed to meet this requirement. This solution can meet high-quality but achieve low-cost.
In order to provide global support behind our customers, WELLER strives to remain on the cutting edge of electronic manufacturing and assembly, as well as potting and encapsulation technology.
Why Work With WELLER？
10+ years focus on high quality electronics manufacturing services including PCB fabrication, SMT assembly, functional testing, as well as:
