Advanced Rigid-flex PCB Manufacturing Capability

Rigid-flex PCBs is a complicated product that demands a lot of interaction between PCB designer and circuit board manufacturers.

Below is our normal manufacturing capability for rigid-flex printed circuits, if you are designing a high complex rigid-flex PCB and need any professional and direct technical support from PCB fabrication house, please contact us freely.

PCB turnkey assembly supplier
ItemProductTechnical Data
01Layer Count2~16Layers
02Min. Line Width/Space18um(finish Cu): 3.5/3.5mil
35um(finish Cu): 4.0/4.0mil
03Min Space Between Coverlay Opening0.2mm
04Edge of Coverlay Opening to Trace0.20mm(preferred)
05Min Space between coverlay and solder pad0.15mm
06Polyimide Films0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ), 5 mils(125µ) as custmer requested
07Thermabond AdhesiveAcrylic/Modified Acrylic, Modified Epoxy, Polyimide
08Copper Foils (RA or ED)1/4oz to 3oz
09FR-4 in Multi-layer Flex CircuitsLaminated to flex circuit to create rigid flex boards, typically with vias
10StiffenersPolyimide, Rigid FR4, PSA, metal, or customer requested
11Solder ResistCoverlay, LPI
12Min. Finished Hole size0.20mm
13Max. Finished Hole size6.30mm
14Hole tolerance±0.05mm
15Min.space between holes0.15mm
16Minimum conductor edge to outline edge≥ 0.10mm
17Tooling toleranceKnife(Soft) tooling ± 0.25mm
Steel(Hard) tooling ± 0.05mm
CNC drill/rout ± 0.10mm
18Maximum Layer to Layer Mis-registration± 0.10mm
19Copper Plated Thickness (PTH only)8~15um;20~30um;30~70um(special)
20PCB Surface FinishImmersion Gold, HASL, Lead free HASL, Plating Hard Gold, OSP

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