You can customize your HDI PCBs utilizing the best options from the list below.
| Item | Capability | Prototype | Mass Production |
|---|---|---|---|
| 01 | Base Material | FR4, Halogen Free, RCC, Ulta Thin Core, RF. | FR4, Halogen Free, RCC, Ulta Thin Core, RF. |
| 02 | Surface Treatment | ENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP | ENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP |
| 03 | Min. Line/Spacing | 2.0/2.0mil | 3.0/3.0mil |
| 04 | Critical Line Width Tolerance | 2.5mil±15% | 2.0mil±10% |
| 05 | Min.Microvia Drill Size (Laser) | 4.0 mil | 4.0 mil |
| 06 | Min.Capture/Target Pad Size | 10.0 mil | 10.0 mil |
| 07 | Min PTH & Buried Drill Bit | 0.20 mm | 0.20 mm |
| 08 | Min. Annular Ring | 3.5mil | 3.0mil |
| 09 | Max. PTH Aspect Ratio | 10:1 | 12:1 |
| 10 | Max. Microvia Aspect Ratio | 0.8:1 | 0.8:1 |
| 11 | Single ended impedance | 50 – 90 ohms: +/- 8% (but no less than 4 ohm) | 50 – 90 ohms: +/- 8% (but no less than 4 ohm) |
| 12 | Differential impedance | 100 – 155 ohms: +/- 10% | 100 – 155 ohms: +/- 10% |
| 13 | Solder Mask Clearance | 1.5 mil | 1.5 mil |
| 14 | Solder Mask Dam | 2.5 mil | 2.5 mil |
| 15 | Min. BGA/CSP pitch | 0.4 mm | 0.4 mm |
| 16 | Registration from Layer to Layer | 2.0 mil | 2.0 mil |
| 17 | Min. dielectric thickness | 1.8 mil | 2.0 mil |
| 18 | PTH Hole Tolerance | +/- 2mil | +/- 3mil |
| 19 | Min. Outline Tolerance | ±0.1mm | ±0.1mm |
| 20 | Min. Core Thickness | 3.0 mil | 3.0 mil |
| 21 | Hole Structure | Stagger Vias, Stacked Via, Skip Via, Stepped Via, ELIC | Stagger Vias, Stacked Via, Skip Via, Stepped Via, ELIC |
| 22 | HDI type I…IV (IPC-2226A) | 1+n+1 … 4+n+4 | 5+n+5 … 9+n+9; Stacked µVia; Any layer µVia |
| 23 | Other Technology | Carbon Jumper, LDI, DLD, Copper Filled Via, VOP | Carbon Jumper, LDI, DLD, Copper Filled Via, VOP |
Any question,please send your concerning to service@wellerpcb.com,and we will response within 4 hours.
