Base material
The base materials used in PCB manufacturing including CCL (Copper Clad Laminate), prepreg, solder mask, silkscreen, and the materials of surface finishing.
Except customer has extra demand, all printed circuit board base materials used by Weller conform to IPC4101( specification for base materials for rigid and multilayer printed boards ) and 100% UL certificated at least.
We never sacrifice quality by using the poor quality of materials fropm unknown sources.
The table below is an extract of certain characteristics from IPC-4101 classifications, highlighting some of the details already referenced.
| IPC-4101 | /99 | /101 | /121 | /124 | /126 | /127 | /127 | /129 | /130 |
| Tg (min) C | 150 | 110 | 110 | 150 | 170 | 110 | 150 | 170 | 170 |
| Td (min) C | 325 | 310 | 310 | 325 | 340 | 310 | 325 | 340 | 340 |
| CTE Z 50-260 C | 3.5% | 4.0% | 4.0% | 3.5% | 3.0% | 40.% | 3.5% | 3.5% | 3.0% |
| T260 (min) minutes | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| T288 (min) minutes | 5 | 5 | 5 | 5 | 15 | 5 | 5 | 15 | 15 |
| Fillers > 5% | Yes | Yes | NA | NA | Yes | Yes | Yes | NA | Yes |
| Dk/Permittivity (max) | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 |
If you have a good experience of a material which you know works for your product, you can send it to us as a reference.
Some Key Material Characteristic
| CTE-Z axis(Co-efficient of thermal expansion): | This is a measure of how much the base material will expand when heated. Measured as PPM/degree C (both before and after Tg) and also in % over a temperature range. Typical Low CTE High Tg PCB Material EM-827 827B |
| Td (Decomposition temperature): | This is the temperature at which material weight changes by 5%. This parameter determines the thermal survivability of the material. |
| Tg (Glass transition temperature): | The temperature at which the material stops acting like a rigid material and begins to behave like a plastic / softer. |
| T260 (Time to delamination): | This is the time it take for the base material to delaminate when subjected to a temperature of 260 degrees C. |
| T288 (Time to delamination): | This is the time it take for the base material to delaminate when subjected to a temperature of 288 degrees C. |
| Dk (Dielectric constant): | The ratio of the capacitance using that material as a dielectric, compared to a similar capacitor which has a vacuum as its dielectric. |
| CTI (Comparative tracking Index): | A measure of the electrical breakdown properties of an insulating material. It is used for electrical safety assessment of electrical apparatus. The normal CTI material as High CTI CEM-3 equivalent to FR-4.0: S2126, High thermal resistance: High CTI S3116. |
Our Standard PCB Laminate Material Source
| Brand | Part number | Tg℃ | Td℃ | T260 (min) | T288 (min) | T300 (min) | Thermal Stress (288℃, solder dip) | CTI | Type | Remark |
| Shengyi | S1140 | 140 | 310 | 15 | 2 | NA | >60s | PLC 3 | FR4 | Conventional FR-4 |
| Shengyi | S1141 | 150 | 310 | 15 | 2 | NA | >60s | PLC 3 | FR4 | Conventional FR-4 |
| Shengyi | S1000H | 155 | 348 | >60 | 20 | NA | >100s | PLC 3 | FR4 | High Performance, Mid-Tg, Lead-free |
| Shengyi | S1000-2 | 180 | 345 | >60 | 20 | 5 | >100s | PLC 3 | FR4 | High Tg, Low CTE |
| Shengyi | S1000-2M | 185 | 355 | >60 | 30 | 15 | >100s | PLC 3 | FR4 | High Tg, High Performance, Low CTE |
| Shengyi | S1600 | 135 | 310 | 15 | 2 | NA | >100s | PLC 0 (≥600V) | FR4 | High CTI@PLC 0 (≥600V) |
| Shengyi | S1150G | 155 | 355 | >60 | 45 | NA | >100s | NA | FR4 | Halogen-free, Mid-Tg |
| ITEQ | IT-158 | 155 | 345 | >60 | 20 | NA | >10s | NA | FR4 | Middle Tg, Lead Free |
| ITEQ | IT-180A | 175 | 345 | >60 | 20 | NA | >10s | NA | FR4 | High Tg,Lead Free |
| Kingboard | KB-6160 | 130 | 305 | 10 | NA | NA | >10s | NA | FR4 | IPC-4101C/21 specification is applicable |
| Kingboard | KB-6165 | ≥150 | ≥325 | ≥30 | ≥10 | NA | ≥60s | NA | FR4 | Low CTE |
| Kingboard | KB-6167G | ≥170 | ≥340 | ≥30 | ≥15 | NA | ≥60s | NA | FR4 | UV Blocking and AOI ompatible, Halogen-free |
| Kingboard | KB-6160F | ≥130 | 313 | >10 | NA | NA | ≥10s | ≥175 | FR4 | UV Blocking, IPC-4101E/97, Low CTE |
| Kingboard | KB-6160 | ≥130 | 305 | >10 | NA | NA | ≥10s | ≥175 | FR4 | IPC-4101E/21, UV Blocking and AOI compatible |
| Kingboard | KB-6160A | ≥130 | 305 | >10 | NA | NA | ≥10s | ≥175 | FR4 | IPC-4101E/21; UV Blocking and AOI compatible |
| Kingboard | KB-6160C | ≥130 | 314 | >20 | NA | NA | ≥10s | ≥600 | FR4 | IPC-4101E/97, CTI≥600 |
| NAN YA | NP-140TL | 140 ± 5 | 310 | >10 | NA | NA | >10s | NA | FR4 | HTE copper foil |
| NAN YA | NP-150TL | 150 ± 5 | 314 | >10 | NA | NA | >10s | NA | FR4 | HTE copper foil |
| NAN YA | NP-170TL | 170 ± 5 | NA | NA | NA | NA | >10s | NA | FR4 | IPC-4101B |
| NAN YA | NP-180TL | 175 ± 5 | NA | NA | NA | NA | >10s | NA | FR4 | High Tg 175℃ |
| Isola | FR406 | 170 | 300 | 10 | >2 | NA | >10s | 0.3-0.4 | FR4 | |
| Isola | FR408 | 180 | 360 | 60 | 15 | NA | >10s | 0.4 | FR4 | A high-performance FR-4 epoxy laminate and prepreg |
| Isola | 370HR | 180 | 340 | 60 | 30 | NA | >10s | – | FR4 | The industry’s “best in class” lead-free compatible product |
| Isola | IS410 | 180 | 350 | 50 | 10 | NA | >10s | 0.5 | FR4 | Superior performance through multiple thermal excursions – passes 6x @ 288°C |
Our High Frequency PCB Laminate Material Source
| Brand | Part number | Dielectric Constant (@10 GHz/23°C) | Tg | Td | Thermal Conductivity (@W/m/°K) | Remark |
| Rogers | RO4350B | 3.38 ± 0.05 | >280 | 390 | 0.64 | |
| Rogers | RO4003C | 3.48 ± 0.05 | >280 | 425 | 0.62 | |
| Rogers | TMM3 | 3.27 ± 0.032 | >280 | 425 | 0.70 | |
| Rogers | TMM4 | 4.50 ± 0.045 | >280 | 425 | 0.70 | |
| Rogers | TMM6 | 6.00 ± 0.080 | >280 | 425 | 0.72 | |
| Rogers | TMM10 | 9.20 ± 0.230 | >280 | 425 | 0.76 | |
| Rogers | MM10I | 9.80 ± 0.245 | >280 | 425 | 0.76 | |
| Rogers | TMM13i | 12.85 ±0.35 | >280 | 425 | – | |
| Rogers | RT/duroid® 600 | 6.15± 0.15 | >280 | 500 | 0.49 | |
| Taconic | TLC-27 | 2.75+/-0.05 | Tg>180 | – | 0.24 | |
| Taconic | TLC-30 | 3.00+/-0.05 | Tg>180 | – | 0.24 | |
| Taconic | TLC-32 | 3.20+/-0.05 | Tg>180 | – | 0.24 | |
| Taconic | TLE-95 | 3.00 +/– 0.05 | Tg>180 | – | 0.20 | Dielectric Thickness: 0.13mm |
| Taconic | TLE-95 | 2.95+/– 0.05 | Tg>180 | – | 0.20 | Dielectric Thickness: 0.25-0.80mm |
| Taconic | TLT-0 | 2.45+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-9 | 2.50+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-8 | 2.55+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-7 | 2.60+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-6 | 2.65+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLX-0 | 2.45+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-9 | 2.50+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-8 | 2.55+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-7 | 2.60+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-6 | 2.65+/- 0.04 | Tg>180 | – | 0.19 |
Our Advanced PCB Laminate Material Source
| Brand | Part number | Dielectric Constant (@10 GHz/23°C) | Tg | Td | Thermal Conductivity (@W/m/°K) | Remark | |
| Nelco | Nelco4000-29 | 4.2 | 185 | 350 | 0.46 | Advanced Lead-Free, High-Tg Multifunctional Epoxy | |
| Nelco | N4000-6 | 4.1 (@ 1 GHz (RF Impedance)) | 175 | 325 | 0.3 – 0.4 | High-Tg Multifunctional Epoxy Laminate & Prepreg | |
| Nelco | Nelco4000-13 | 3.6 | 210 | 350 | 0.35 | High-Speed Multifunctional Epoxy Laminate & Prepreg | |
| Panasonic | R-5575 (PP:R-5470) | 3.6 | 245 | – | 0.6 | High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials | |
| Panasonic | R-1755D (PP:R1706） | 4.4 (@ 1 GHz (RF Impedance)) | 163 | 345 | – | High Tg & Low CTE type | |
| TUC Taiwan | TU-872 LK | 3.80 | 200 | 340 | – | Excellent application on Backpanel, High performance computing |
Our Metal PCB Laminate Material Source
| Brand | Part number | Thermal Conductivity (W/(m·K)) | Tg(℃) | Td(℃) | Thermal Stress (288℃, solder float) min | Hi-pot Test (AC.V) | CTI | Remark |
| Shengyi | SAR15 | 1.5 | 140 | 380 | 30 | 3000 | PLC0 | Mid-power LED lighting LED TV Power supply board |
| ITEQ | IT-859GTA | 3.0 | 100 | 380(≥0.5mm) | >60(≥0.5mm) | 1000 | – | IPC-4101C Spec/21;Notebook Light Bar;LED Lighting Application;LCD TV Light Bar;Automobile Lighting;Traffic Lighting;Street Lamp and Lighting |
| Bergquist | MP-06503 | 1.30 | 90 | 325 | – | 2800 | High watt-density applications where achieving low thermal resistance is required |
Our Metal PCB Laminate Material Source
| Brand | Part number | Dielectric Constant (@1 MHz) | Tg | Solder Float @10 sec at 288°C (550°F) | UL | Remark |
| Taiflex | MHK3025 | – | – | Pass | – | Halogen Free |
| DuPont | PYRALUX AC | 3.7 | – | Pass | 94V-0 | Excellent thermal resistance |
| DuPont | PYRALUX AP | 3.2(@10GHz) | 220 | Pass | V-0 VTM-0 | IPC slash sheet: 4204/11; Halogen Free: Yes 4 hours |
| DuPont | FR7001 | 3.5 | – | Pass | UL746E | |
| Thin Flex | A-2005ED | 3.3 | 350 | Pass | 94V-0 | |
| Thin Flex | W-0505ED | 3.3 (@1GHz) | 350 | Pass | 94V-0 |
More information on PCB Laminates, visit the following websites:
| Supplier | Web site |
| SHENG YI | www.syst.com.cn |
| KINGBOARD | www.kingboard.com |
| ROGERS | www.rogerscorp.com |
| ISOLA | www.isola-group.com |
| ITEQ | www.iteq.com.tw |
| TACONIC | www.taconic-add.com |
| NAN YA | www.npc.com.tw |
| DUPONT | www.dupont.com |
| NELCO | www.parkelectro.com |
| TAIFLEX | www.taiflex.com |
| THINFLEX | www.thinflex.com.tw |
If your circuit board must work at specific high voltage, high current or perform high speed or high frequency signal transmission, to reduce the hidden risk and avoid the failure, it is critical to find an outstanding professional PCB fabricate house and look for a best laminate material not cheapest to fabricate your circuit board.