Weller Technology offers an extensive broad arrange of electrical and electro-mechanical and PCB (rigid PCB and flex PCB) manufacturing services. These services can include pre-engineering, PCB SMD assembly, PCB PTH assembly, design for maneuverability (DFM) support, design for test (DFT), compliance testing, final packaging, and logistics optimizing services.
Innovation and investment in keeping Weller at the cutting edge helps maintain our position as a professional electronic industry leader in the manufacturing field of small volume and quick turns.
Our state of the art 4000 square meters electronic assembly facility contains an impressive list of equipment including over 1000 square meters medical clean room. Our PCB assembly capabilities include:
| Surface Mount (SMT) Assembly | Through-Hole Assembly |
| Mixed Technologies challenges | Rigid, Flex, Rigid-Flex PCB assembly |
| Solder & Washing PCB | AOI Inspection |
| X-Ray inspection | Functional Testing |
| Repid Prototyping | Repair Service |
| Conformal Coating: Humiseal-1B73 | Potting & Encapsulation (by Resin) |
| Box Build Assembly | Components Sourcing & Logistics |
SMT Assembly Capability Review
| Components | Resistors, caps, diodes,Sips, Dips, IC, BGA, LED, Connetcors, Headers, some through hole parts, etc. |
| Components Min x Max (W x L) | (0.254 x 0.13mm ) 01005 – 100 x 45mm (3.94 x 1.77″) |
| Components Min x Max Height | .005 – 2.00″ |
| PCB Materials | Flex, Rigid-flex, RF, CEM, Aluminum, Copper base |
| Solder Paste | Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), No Clean etc. Available Brand: Aalpha Paste: ALPHA OM-340; Indium Paste: Low voids indium-8.9HF; Koki Paste: Low voids S3X58-HF1100-3; |
| Solder Paste Flux | Lead-free, water soluble, rosin, No-clean, etc. |
| PCB Min & Max (W x L) | 100″ x .100″ min (Pallets) – 30″ x 30″ max |
| PCB Thickness (Min – Max) | .010″(Fiber) (1mill Flex) min – .500″ max |
| Paste Inspection | 2D, Laser |
Radial Insertion
| Cycle Rate | 22,000 |
| Component Types | Capacitors, resistors, diodes, jumpers, etc |
| Component Types | 0.300″min – 0.950″max |
| Hole Span | 0.100″ min – 0.460″ width max |
| Component Body Diameter | 0.100″ min – 0.460″ width max |
| Lead Wire Diameter | 0.015’min – 0.032″max |
| PCB Min x Max (WxL) | 2” x 2” Min – 22″ x 18.5″ Max |
| Insertable Area (WxL) | 20″ x 18.5″ |
| Board Error Correction | BEC feature compensation for PCB pattern errors |
| Verifier | Expandable range verifier (ERV) ensures operator accuracy of component loading |
| PCB Materials | Flex, Rigid-flex, RF, CEM, Aluminum |
DIP (Dual Inline-Pin Package) Insertion
| Cycle Rate | 4,500 |
| Component Types | .300 Dip & Sockets .600 Dip & Sockets |
| Compenent Max Size (LxDxH) | 0.512″ x 0.512″ x 0.906″ |
| PCB Min x Max (WxL) | 2 x 2″ Min – 22′ x 18.5″ Max |
| PCB Thickness Min x Max | .010 Min – 0.250″ Max |
| Insertable Area (WxL) | 20″ x 18.5″ |
| Board Error Correction | BEC feature compensation for PCB pattern errors |
| Verifier | Expandable range verifier (ERV) ensures operator accuracy of component loading |
| PCB Materials | Flex, Rigid-flex, RF, CEM, Aluminum |
Solder Processing
| Solder types | Manual, Mass wave, Seletcive,reflow |
| Solder metals | Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc. |
| Flux materials | VOC-free, Lead-free, water soluble, rosin, No-clean, etc. |
| Fluxing Applicators | Ultra sonic, spray, drop jet, foam, etc. |
| PCB Min & Max (WxL) | .100 x .100 min (Pallets) – 30″ x 30″ max |
| PCB Thickness Min – Max | .010″ min – 1″ max |
| PCB base materials | Flex, Rigid-flex, RF, CEM, Aluminum |
AOI Inspection
| Inspection Types | 3D-X-Ray, AOI Automatic Optical Inspection |
| Magnification | 255 times |
| Solder inspection | Color & X-ray |
| PCB size Min – Max (WxL) | .100″ x.100 min – .30″ x 30″max |
Functional Testing
| Functional | Firmware burn-in, Power up, cycle, Aging test, etc. |
| Flying Probe | 24 probe, 35″ x 25″max |
| RF | Synthesized Signal Generator, Frequency Synthesizers, etc. |
Firmware Programming
| System platform | Windows 7,Windows 10, OS, Linux. |
| IC type | ST,Ateml,TI…etc |
Repair & Upgrade Rework
| SMD | Passives (03015 on up), processors, BGA, etc. |
| Through Hole | Axial, radial, dip, sip, transformers, connetcors, headers, etc. |
| Cable | Rigid wire, flex circuit, fiber optic, connetcors, etc. |
| PCB Repair | Trace, via, through hole, smt, etc. |
Conformal Coating
| Coating Materials | Acrylic, silicon, UV, etc. DCA200H & AFA200 |
| SCS Precisioncoat spray and despense system | Capable of applying solvent and water based coatings, along with solids with accuracy of 0.001 inches |
| Minimum/ Maximum Substrate size LxW | 2×2″ -20×20″ |
| Maximum Substrate size Height | 4″ |
| Coating thickness | 25-250 μm (normal: 50um) |
Resin Potting
| Epoxy Materials | 2 part epoxy, Urethane, Silicone, conductive, non-conductive, under fills, etc. 3M-DP270 Epic-S7302 |
Box Build Assembly
| Box Build Assembly | Wiring, assembly, testing, labeling, shipping, etc. |
Components Procurement
| Purchasing | World wide |
| Component Tacking | 100% component & product tracking |
| Component Guarantee | Hi-Tech sources only top quality components, including single, double and multi-layer boards, semiconductors, active and passive components, and electro-mechanical assemblies. |