Standard 8L PCB Stack-up Design Reference

These standard 8L layers PCB stack-up is the most common options selected by PCB designers. The standard layer buildup can be utilized in most applications. Also, these options collected most possible considerations including reliability, performance, and PCB manufacturing cost.

As a standard option, you can get a variable multi-layer PCB stack-up options from us, which is defined by following:

Prepreg: All the prepreg selection refer S1000HB

Base material:: Tg-170 ( Strongly Recommend)

PCB thickness: 1.0mm/1.6mm/2.0mm/2.4mm/3.0mm

Final finished copper thickness: 1/1/1/1/1//1/1/1oz (Note: the out layer copper thickness below is base copper thickness+plating copper)

8L, T=1.00mm, 1/1/1/1/1/1/1/1 oz

8L PCB Stack-Up T=1.00mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 2116X1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 60 Core
IN2 L3 Copper 35 Copper
Prepreg 2116X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 60 Core
IN4 L5 Copper 35 Copper
Prepreg 2116X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 60 Core
IN6 L7 Copper 35 Copper
Prepreg 2116X1 Prepreg
BOT L8 Copper 18 Base Copper
20-25 Plating Copper
SMB Solder Mask
Nornimal PCB thickness: 1.00+/-0.10mm

8L, T=1.60mm, 1/1/1/1/1/1/1/1 oz

8L PCB Stack-Up T=1.60mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 180 Core
IN2 L3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 180 Core
IN4 L5 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 180 Core
IN6 L7 35 Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
BOT L8 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Nornimal PCB thickness: 1.60+/-0.16mm

8L, T=2.00mm, 1/1/1/1/1/1/1/1 oz

8L PCB Stack-Up T=2.00mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080x1 Prepreg
Prepreg 7628x1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 280 Core
IN2 L3 Copper 35 Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 280 Core
IN4 L5 Copper 35 Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 280 Core
IN6 L7 Copper 35 Core
Prepreg 7628x1 Prepreg
Prepreg 1080x1 Prepreg
BOT L8 Prepreg 18 Base Copper
20-25 Plating Copper
SMB Solder Mask
Nornimal PCB thickness: 2.00+/-0.20mm

8L, T=2.40mm, 1/1/1/1/1/1/1/1 oz

8L PCB Stack-Up T=2.40mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 440 Core
IN2 L3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 440 Core
IN4 L5 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 440 Core
IN6 L7 35 Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
BOT L8 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Nornimal PCB thickness: 2.40+/-0.24mm

8L, T=3.00mm, 1/1/1/1/1/1/1/1 oz

8L PCB Stack-Up T=3.00mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 640 Core
IN2 L3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 640 Core
IN4 L5 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 640 Core
IN6 L7 35 Copper
Prepreg 1080x1 Prepreg
Prepreg 1080x1 Prepreg
BOT L8 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Nornimal PCB thickness: 3.00+/-0.30mm

Above stack up is our standard 8L layer PCB buildup that upon the best manufacturing features (quality and price). We strongly recommend to use Tg170 laminate material for a multi-layer PCB (>= 8 layers) stack-up construction to avoid any potential quality problem during your PCB assembly process: such as delamination, blister in lead free assembly process, etc.

Above stack up is our standard 8L layer buildup with 1/1/1/1/1/1/1/1 oz final finished copper thickness that the upon best manufacturing features for multi-layer PCB.

If you need a customized multi-layer PCB stack up or buildup with impedance control for specific 8L circuit board, or you need 2oz or upper copper thickness PCB stack up, please feel freely send your request to service@wellerpcb.com.

Shengyi Prepreg S1000HB Reference

Based Material Line Up S1000H (S1000HB)-PREPREG (B-STAGE)

Glass style RC (%) Nominal Thickness Dk Df
mm mil 1GHz 3GHz 5GHz 10GHz 1 GHz 3 GHz 5 GHz 10 GHz
7628 43* 0.185 7.28 4.81 4.74 4.74 4.73 0.014 0.015 0.015 0.016
7628 46 0.195 7.68 4.74 4.68 4.66 4.66 0.015 0.016 0.016 0.016
7628 48 0.205 8.07 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
7628 50 0.215 8.46 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
7628 52 0.225 8.86 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
1506 48 0.160 6.30 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
1506 50 0.170 6.69 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
1506 52 0.180 7.09 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 52* 0.113 4.45 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 53* 0.116 4.57 4.57 4.50 4.49 4.48 0.016 0.017 0.017 0.018
2116 55 0.120 4.72 4.53 4.45 4.43 4.43 0.017 0.017 0.018 0.018
2116 58 0.130 5.12 4.45 4.38 4.36 4.36 0.017 0.018 0.018 0.018
3313 57 0.100 3.94 4.48 4.41 4.39 4.39 0.017 0.018 0.018 0.018
1080 65 0.072 2.83 4.29 4.21 4.19 4.18 0.019 0.019 0.019 0.020
1080 68 0.081 3.19 4.21 4.13 4.11 4.11 0.020 0.019 0.020 0.020
1080 70 0.087 3.43 4.16 4.08 4.05 4.05 0.020 0.019 0.020 0.020
106 73 0.050 1.97 4.09 4.01 3.97 3.97 0.020 0.020 0.020 0.020
106 78 0.063 2.14 3.97 3.89 3.83 3.83 0.02 0.021 0.020 0.022
Remark:
1) Test by SPDR method.
2) The data above show actual values and are not guaranteed, for your reference only.
3) RC* is not common type for reference.
4) Last update: Oct, 2020

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