WELLER Technology dedicated to providing advanced PCB manufacturing services with consistent high quality and affordable pricing. Whether it is only for prototypes or even large volume of production runs, we can meet our customer’s PCB fabrication needs in a variety of laminate materials and latest mixed technologies. We have been focusing on multi-layer, high frequency, backplane, impedance controlled, heavy copper, HDI, and rigid-flex PCB’s in varying complexities.
Understanding PCB manufacturing capabilities will greatly help the designer to optimize the layout and have cost saving when it comes to production. The tables below list our manufacturing capabilities.
Rigid PCB Manufacturing Capability
| ITEM | CAPABILITIES | STANDARD PRODUCTION | ADVANCED PRODUCTION |
|---|---|---|---|
| 01 | Maximum layer count | 32L | 60L |
| 02 | Max board thickness | 3.2mm [0.125″] | 6.5mm [0.256″] |
| 03 | Min board thickness | 0.20mm [0.008″] | 0.10mm [0.004″] |
| 04 | Maximum copper weight | 5oz [178µm] | 6 oz [214µm] |
| 05 | Minimum copper weight | 1/3 oz [12µm] | 1/4 oz [9µm] |
| 06 | Minimum core thickness | 50µm [0.002″] | 38µm [0.0015″] |
| 07 | Minimum dielectric thickness | 64µm [0.0025″] | 38µm [0.0015″] |
| 08 | Minimum pad size over drill | 0.46mm [0.018″] | 0.4mm [0.016″] |
| 09 | Surface finishes | HASL (solder), HAL LF, hard gold, bondable gold, immersion gold, immersion silver, immersion Tin, OSP. | HASL (solder), HAL LF, hard gold, bondable gold, immersion gold, immersion silver, immersion Tin, OSP. |
| 10 | Solder mask color | Green, blue, red, black, white, yellow and clear (LPI, LDI) | Green, blue, red, black, white, yellow and clear (LPI, LDI) |
| 11 | Solder mask registration | ± 50µm [0.002″] | ± 38µm [0.0015″] |
| 12 | Minimum solder mask dam | 76µm [0.003″] | 64µm [0.0025″] |
| 13 | Silkscreen color | White, black, yellow, red. Both sides allowed. (Legend should have minimum 5 mils (0.005″) trace width). | White, black, yellow, red. Both sides allowed. (Legend should have minimum 5 mils (0.005″) trace width). |
| 14 | Maximum panel size | 533x610mm [21×24″] | 610x1067mm [24×42″] |
| 15 | Minimum mechancial drill size | 0.16mm [0.006″] | 0.16mm [0.006″] |
| 16 | Minimum laser drill size | 0.10mm [0.004″] | 0.10mm [0.004″] |
| 17 | Copper feature to edge, V‐cut (30°) | 0.40mm [0.016″] | 0.36mm [0.014″] |
| 18 | Copper feature to PCB edge, routed | 0.25mm [0.010″] | 0.20mm [0.008″] |
| 19 | Annular Ring | 0.10mm (0.004”) | 0.10mm (0.004”) |
| 20 | Aspect ratio | 10:1 | 25:1 |
| 21 | Rigid‐flex & flexible circuits | Y | Y |
| 22 | Buried and blind Vias | Y | Y |
| 23 | Sequential lamination | Y | Y |
| 24 | Single ended impedance | 50 – 90 ohms +/- 8% but no less than 4 ohm | 50 – 90 ohms +/- 8% but no less than 4 ohm |
| 25 | Differential impedance | 100 – 155 ohms +/- 10% | 100 – 155 ohms +/- 10% |
| 26 | Coplanar waveguide impedance | 50-90ohms: +/-5 ohm | 50-90ohms: +/-5 ohm |
| 27 | Hybrids & mixed dielectrics | Y | Y |
| 28 | Aluminum or copper based PCB’s | Y | Y |
| 29 | Non‐conductive Via Fill (VIP) | Y | Y |
| 30 | Conductive Via Fill | Y | Y |
| 31 | Cavity boards | Y | Y |
| 32 | Back drilling | Y | Y |
| 33 | Controlled depth drill and route | Y | Y |
| 34 | Edge plating | Y | Y |
| 35 | Buried capacitance | Y | Y |
| 36 | Etch back | Y | Y |
| 37 | In‐board beveling | Y | Y |
| 38 | In‐board gold fingers | Y | Y |
| 39 | 2‐D bar code printing | Y | Y |
| 40 | Outer Layer Trace/Spacing (1/3oz starting foil + platig) | 0.40mm [0.016″] | 0.36mm [0.014″] |
| 41 | Inner Layer Trace/Spacing (Hoz inner layer cu) | Copper Feature to PCB Edge, Routed0.25mm [0.010″] | 0.20mm [0.008″] |
| 42 | Tolerance on overall dimensions | +/-100µm [0.004″] | +/-50µm [0.002″] |
| 43 | Copper coin embedded | Y (coin material:red copper) | Y (coin material:red copper) |