Standard FR4 PCB Manufacturing Capabilities

High quality PCBs produced with full responsibility from prototype to volume

WELLER Technology dedicated to providing advanced PCB manufacturing services with consistent high quality and affordable pricing. Whether it is only for prototypes or even large volume of production runs, we can meet our customer’s PCB fabrication needs in a variety of laminate materials and latest mixed technologies. We have been focusing on multi-layer, high frequency, backplane, impedance controlled, heavy copper, HDI, and rigid-flex PCB’s in varying complexities.

Understanding PCB manufacturing capabilities will greatly help the designer to optimize the layout and have cost saving when it comes to production. The tables below list our manufacturing capabilities.

PCB turnkey assembly supplier

Rigid PCB Manufacturing Capability

ITEMCAPABILITIESSTANDARD
PRODUCTION
ADVANCED
PRODUCTION
01Maximum layer count 32L60L
02Max board thickness3.2mm [0.125″]6.5mm [0.256″]
03Min board thickness0.20mm [0.008″]0.10mm [0.004″]
04Maximum copper weight 5oz [178µm]6 oz [214µm]
05Minimum copper weight1/3 oz [12µm]1/4 oz [9µm]
06Minimum core thickness50µm [0.002″]38µm [0.0015″]
07Minimum dielectric thickness64µm [0.0025″]38µm [0.0015″]
08Minimum pad size over drill0.46mm [0.018″]0.4mm [0.016″]
09Surface finishesHASL (solder), HAL LF, hard gold, bondable gold, immersion gold, immersion silver, immersion Tin, OSP.HASL (solder), HAL LF, hard gold, bondable gold, immersion gold, immersion silver, immersion Tin, OSP.
10Solder mask colorGreen, blue, red, black, white, yellow and clear (LPI, LDI)Green, blue, red, black, white, yellow and clear (LPI, LDI)
11Solder mask registration± 50µm [0.002″]± 38µm [0.0015″]
12Minimum solder mask dam76µm [0.003″]64µm [0.0025″]
13Silkscreen colorWhite, black, yellow, red. Both sides allowed. (Legend should have minimum 5 mils (0.005″) trace width).White, black, yellow, red. Both sides allowed. (Legend should have minimum 5 mils (0.005″) trace width).
14Maximum panel size533x610mm [21×24″]610x1067mm [24×42″]
15Minimum mechancial drill size0.16mm [0.006″]0.16mm [0.006″]
16Minimum laser drill size0.10mm [0.004″]0.10mm [0.004″]
17Copper feature to edge, V‐cut (30°)0.40mm [0.016″]0.36mm [0.014″]
18Copper feature to PCB edge, routed0.25mm [0.010″]0.20mm [0.008″]
19Annular Ring0.10mm (0.004”)0.10mm (0.004”)
20Aspect ratio10:125:1
21Rigid‐flex & flexible circuitsYY
22Buried and blind ViasYY
23Sequential laminationYY
24Single ended impedance50 – 90 ohms +/- 8% but no less than 4 ohm50 – 90 ohms +/- 8% but no less than 4 ohm
25Differential impedance100 – 155 ohms +/- 10%100 – 155 ohms +/- 10%
26Coplanar waveguide impedance50-90ohms: +/-5 ohm50-90ohms: +/-5 ohm
27Hybrids & mixed dielectricsYY
28Aluminum or copper based PCB’sYY
29Non‐conductive Via Fill (VIP)YY
30Conductive Via FillYY
31Cavity boardsYY
32Back drillingYY
33Controlled depth drill and routeYY
34Edge platingYY
35Buried capacitanceYY
36Etch backYY
37In‐board bevelingYY
38In‐board gold fingersYY
392‐D bar code printingYY
40Outer Layer Trace/Spacing
(1/3oz starting foil + platig)
0.40mm [0.016″]0.36mm [0.014″]
41Inner Layer Trace/Spacing
(Hoz inner layer cu)
Copper Feature to PCB Edge, Routed0.25mm [0.010″]0.20mm [0.008″]
42Tolerance on overall dimensions+/-100µm [0.004″]+/-50µm [0.002″]
43Copper coin embeddedY (coin material:red copper)Y (coin material:red copper)

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