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Standard 10L PCB Stack-up Design Reference

The standard 10L layers PCB stackup is the most common options selected by PCB designers. These standard layer stack-ups can be utilized in most applications.

As a standard option, you can get a variable 10 layer stack up from us, which is defined by following:

Prepreg: All the prepreg selection refer S1000HB

Base materials: Tg-170 (Strongly Recommend)

PCB thickness: 1.33mm/1.60mm/2.00mm/2.40mm/3.00mm

Final finished copper thickness: 1/1/1/1/1/1/1/1/1/1 oz (Note: the out layer copper thickness is: base copper+plating copper)

Remark: The Prepreg thickness could be adjusted according to track distribution.)

10L, T=1.33mm, 1/1/1/1/1/1/1/1/1/1 oz

10L PCB Stack-Up T=1.33mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 2116X1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 95
IN3 L3 Copper 35 Copper
Prepreg 2116X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 95
IN4 L5 35 Copper
Prepreg 2116X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 95
IN6 L7 35 Copper
Prepreg 2116X1 Prepreg
IN7 L8 35 Copper
Core FR4 95
IN8 L9 35 Copper
Prepreg 2116X1 Prepreg
BOT L10 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Final PCB thickness: 1.33+/-0.13mm

10L, T=1.60mm, 1/1/1/1/1/1/1/1/1/1 oz

10L PCB Stack-Up T=1.60mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 2116X1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 140
IN3 L3 Copper 35 Copper
Prepreg 2116X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 140
IN4 L5 35 Copper
Prepreg 2116X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 140
IN6 L7 35 Copper
Prepreg 2116X1 Prepreg
IN7 L8 35 Copper
Core FR4 140
IN8 L9 35 Copper
Prepreg 2116X1 Prepreg
BOT L10 Copper 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Final PCB thickness: 1.60+/-0.16mm

10L, T=2.00mm, 1/1/1/1/1/1/1/1/1/1 oz

10L PCB Stack-Up T=2.00mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080X1 Prepreg
Prepreg 1080X1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 180
IN3 L3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 180
IN4 L5 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 180
IN6 L7 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN7 L8 Copper 35 Copper
Core FR4 180
IN8 L9 Copper 35 Copper
Prepreg 1080X1 Prepreg
Prepreg 1080X1 Prepreg
BOT L10 Copper 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Final PCB thickness: 2.00+/-0.20mm

10L, T=2.40mm, 1/1/1/1/1/1/1/1/1/1 oz

10L PCB Stack-Up T=2.40mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080X1 Prepreg
Prepreg 7628X1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 180
IN3 L3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 180
IN4 L5 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 180
IN6 L7 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN7 L8 Copper 35 Copper
Core FR4 180
IN8 L9 Copper 35 Copper
Prepreg 7628X1 Prepreg
Prepreg 1080X1 Prepreg
BOT L10 Copper 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Final PCB thickness: 2.40+/-0.24mm

10L, T=3.00mm, 1/1/1/1/1/1/1/1/1/1 oz

10L PCB Stack-Up T=3.00mm

Layer T: =um Material
SMT Solder Mask Solder Mask
TOP L1 Copper 20-25 Plating Copper
18 Base Copper
Prepreg 1080X1 Prepreg
Prepreg 7628X1 Prepreg
IN1 L2 Copper 35 Copper
Core FR4 290
IN3 L3 Copper 35 Copper
Prepreg 7628X1 Prepreg
Prepreg 7628X1 Prepreg
IN3 L4 Copper 35 Copper
Core FR4 290
IN4 L5 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN5 L6 Copper 35 Copper
Core FR4 290
IN6 L7 Copper 35 Copper
Prepreg 7628X1 Prepreg
Prepreg 7628X1 Prepreg
IN7 L8 Copper 35 Copper
Core FR4 290
IN8 L9 Copper 35 Copper
Prepreg 7628X1 Prepreg
Prepreg 1080X1 Prepreg
BOT L10 Copper 18 Base Copper
20-25 Plating Copper
Solder Mask Solder Mask
Final PCB thickness: 3.00+/-0.30mm

Above stack up is our standard 10L layer rigid PCB buildup with 1/1/1/1/1/1/1/1/1/1 oz final finished copper thickness that upon the best manufacturing features (quality and price). We strongly recommend to use FR-4 laminate material with Tg170 for multi-layer PCB (>= 6 layers) to avoid any potential quality problem during your PCB assembly procedures: such as layers de-lamination, blister in lead free assembly process, etc.

If you need a customized stack up or stack up with specific impedance control at 10L circuit board, or you need 2 oz or upper copper thickness PCB build up, you can freely send your request to service@wellerpcb.com.

Shengyi Prepreg S1000HB Reference

Based Material Line Up S1000H (S1000HB)-PREPREG (B-STAGE)

Glass style RC (%) Nominal Thickness Dk Df
mm mil 1GHz 3GHz 5GHz 10GHz 1 GHz 3 GHz 5 GHz 10 GHz
7628 43* 0.185 7.28 4.81 4.74 4.74 4.73 0.014 0.015 0.015 0.016
7628 46 0.195 7.68 4.74 4.68 4.66 4.66 0.015 0.016 0.016 0.016
7628 48 0.205 8.07 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
7628 50 0.215 8.46 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
7628 52 0.225 8.86 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
1506 48 0.160 6.30 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
1506 50 0.170 6.69 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
1506 52 0.180 7.09 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 52* 0.113 4.45 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 53* 0.116 4.57 4.57 4.50 4.49 4.48 0.016 0.017 0.017 0.018
2116 55 0.120 4.72 4.53 4.45 4.43 4.43 0.017 0.017 0.018 0.018
2116 58 0.130 5.12 4.45 4.38 4.36 4.36 0.017 0.018 0.018 0.018
3313 57 0.100 3.94 4.48 4.41 4.39 4.39 0.017 0.018 0.018 0.018
1080 65 0.072 2.83 4.29 4.21 4.19 4.18 0.019 0.019 0.019 0.020
1080 68 0.081 3.19 4.21 4.13 4.11 4.11 0.020 0.019 0.020 0.020
1080 70 0.087 3.43 4.16 4.08 4.05 4.05 0.020 0.019 0.020 0.020
106 73 0.050 1.97 4.09 4.01 3.97 3.97 0.020 0.020 0.020 0.020
106 78 0.063 2.14 3.97 3.89 3.83 3.83 0.02 0.021 0.020 0.022
Remark:
1) Test by SPDR method.
2) The data above show actual values and are not guaranteed, for your reference only.
3) RC* is not common type for reference.
4) Last update: Oct, 2020

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