Standard 6L PCB Stack-up Design Reference

The standard 6L layers PCB stack-up is the most common options selected by PCB designers. The standard layer stack-up can be utilized in most applications.

As a standard option, you can get a variable 6 layer stack-up from us, which is defined by following:

Prepreg: All the prepreg selection refer S1000HB

Base material:: Tg>=150 (Strongly recommend)

PCB thickness: 0.7mm/0.8mm/1.0mm/1.6mm/2.0mm/2.4mm/3.0mm

Final finished copper thickness: 1/1/1/1/1/1oz (Note: the out layer copper thickness: base copper+plating copper)

6L, T=0.70mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=0.70mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 2116X1 Prepreg
IN1 2 Copper 35 Copper
Core FR4 60 Core
IN2 3 Copper 35 Copper
Prepreg 2116X1 Prepreg
IN3 4 Copper 35 Copper
Core FR4 60 Core
IN4 5 Copper 35 Copper
Prepreg 2116X1 Prepreg
BOT 6 Copper 18 Base copper
18-25 Copper plating
SMB Solder Mask 20 Solder Mask
Nornimal PCB thickness: 0.7+/-0.10mm

6L, T=0.80mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=0.80mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 2116X1 Prepreg
IN1 2 Copper 35 Copper
Core FR4 60 Core
IN2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 4 Copper 35 Copper
Core FR4 60 Core
IN4 5 Copper 35 Copper
Prepreg 2116X1 Prepreg
BOT 6 Copper 18 Base copper
18-25 Copper plating
SMB Solder Mask 20 Solder Mask
Nornimal PCB thickness: 0.80+/-0.10mm

6L, T=1.00mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=1.00mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 2116X1 Prepreg
IN1 2 Copper 35 Copper
Core FR4 140 Core
IN2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
IN3 4 Copper 35 Copper
Core FR4 140 Core
IN4 5 Copper 35 Copper
Prepreg 2116X1 Prepreg
BOT 6 Copper 18 Base copper
18-25 Copper plating
SMB Solder Mask 20 Solder Mask
Nornimal PCB thickness: 1.00+/-0.10mm

6L, T=1.60mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=1.60mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
IN1 2 Copper 35 Copper
Core 290 Core
IN2 3 Copper 35 Copper
Prepreg 7628X1
IN3 4 35 Copper
Core 290 Core
IN4 5 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 6 18 Base copper
18-25 Copper plating
20 Solder Mask
Nornimal PCB thickness: 1.60+/-0.16mm

6L, T=2.00mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=2.00mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
IN1 2 Copper 35 Copper
Core 440 Core
IN2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
7628X1
IN3 4 35 Copper
Core 440 Core
IN4 5 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 6 18 Base copper
18-25 Copper plating
20 Solder Mask
Nornimal PCB thickness: 2.00+/-0.20mm

6L, T=2.40mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=2.40mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
IN1 2 Copper 35 Copper
Core 640 Core
IN2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
7628X1
IN3 4 35 Copper
Core 640 Core
IN4 5 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 6 18 Base copper
18-25 Copper plating
20 Solder Mask
Nornimal PCB thickness: 2.40+/-0.24mm

6L, T=3.00mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=3.00mm

Layer T: um Material
SMT Solder Mask 20 Solder Mask
Top 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
IN1 2 Copper 35 Copper
Core 1130 Core
IN2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
7628X1
IN3 4 35 Copper
Core 1130 Core
IN4 5 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 6 18 Base copper
18-25 Copper plating
20 Solder Mask
Nornimal PCB thickness: 3.00+/-0.30mm

Above stack up is our standard 6L layer PCB buildup with with 1/1/1/1/1/1 oz  final finished copper thickness  that upon the best manufacturing features (reliability, performance, and production cost). We recommend to use Tg150 for multi-layer PCB more than 4 layers to avoid any potential quality problem during your PCB assembly process: such as de-lamination, blister, etc, in high temperature of lead-free assembly process.

If you need a customized Multi-layer PCB stack-up or any stack up with impedance control, or you need 2oz or upper copper thickness PCB stack up, you can send your request to service@wellerpcb.com. Our engineer will have a professional response with 2-4 hours.

Shengyi Prepreg S1000HB Reference

Based Material Line Up S1000H (S1000HB)-PREPREG (B-STAGE)

Glass style RC (%) Nominal Thickness Dk Df
mm mil 1GHz 3GHz 5GHz 10GHz 1 GHz 3 GHz 5 GHz 10 GHz
7628 43* 0.185 7.28 4.81 4.74 4.74 4.73 0.014 0.015 0.015 0.016
7628 46 0.195 7.68 4.74 4.68 4.66 4.66 0.015 0.016 0.016 0.016
7628 48 0.205 8.07 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
7628 50 0.215 8.46 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
7628 52 0.225 8.86 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
1506 48 0.160 6.30 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
1506 50 0.170 6.69 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
1506 52 0.180 7.09 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 52* 0.113 4.45 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 53* 0.116 4.57 4.57 4.50 4.49 4.48 0.016 0.017 0.017 0.018
2116 55 0.120 4.72 4.53 4.45 4.43 4.43 0.017 0.017 0.018 0.018
2116 58 0.130 5.12 4.45 4.38 4.36 4.36 0.017 0.018 0.018 0.018
3313 57 0.100 3.94 4.48 4.41 4.39 4.39 0.017 0.018 0.018 0.018
1080 65 0.072 2.83 4.29 4.21 4.19 4.18 0.019 0.019 0.019 0.020
1080 68 0.081 3.19 4.21 4.13 4.11 4.11 0.020 0.019 0.020 0.020
1080 70 0.087 3.43 4.16 4.08 4.05 4.05 0.020 0.019 0.020 0.020
106 73 0.050 1.97 4.09 4.01 3.97 3.97 0.020 0.020 0.020 0.020
106 78 0.063 2.14 3.97 3.89 3.83 3.83 0.02 0.021 0.020 0.022
Remark:
1) Test by SPDR method.
2) The data above show actual values and are not guaranteed, for your reference only.
3) RC* is not common type for reference.
4) Last update: Oct, 2020

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