How to Choose Prepreg Dk Value When Design a PCB Stack-UP
The Prepreg in the PCB stack-up plays on a critical role on the circuit board’s durable reliability and operation performance. Especially some advanced PCB design with requiring strict dielectric thickness between circuit layers.
The Difference between IPC-6012, IPC-A-600, and IPC-A-610
IPC-A-600: Acceptance criteria for various types of printed circuit boards. IPC-6012 class 1, 2, 3, manufacturing and performance specifications for rigid printed circuit boards. IPC-A-610 is the criteria guiding the Acceptability of Electronics Assemblies.
Potting Resins in PCB Electronic Assembly
Today the electronics industry is one of the most rapidly expanding industries in the world, with an almost unlimited range of applications. more and more printed circuit boards (PCBs) are found in many domestic, industrial, automotive and military devices and require protection from their environment.
The Difference between PCB fabrication with Back Drilling and Controlled Depth Drilling
PCB Back Drilling is one of the special controlled depth drilling (NPTH) in the loop of PCB manufacturing process. Normally, there will be various challenges in engineering and production when it comes to PCB design and printed circuit board manufacturing and one of them is how to ensure high performance of retaining signal integrity.
How to Choose Surface Treatment Process for PCB
The choice of PCB surface treatment process depends mainly on the type of component that is finally assembled. And the surface treatment process will affect the production, assembly and end use of the PCB.
The PCB Silkscreen Design Guidelines
Silkscreen is one of important compositions to a complete PCB board fabrication, especially it's high importance to finally circuit board assembly. Good work on silkscreen design will be more friendly to PCB manufacturing and assembly.