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Service Agreement Terms and Conditions
The purpose of this specification is to outline specifications for production of bare printed circuit boards to assure that incoming printed circuit boards (PCB) meet WELLER EMS’s requirements.
Acceptance criteria not specifically detailed in customer documentation, this specification, in a separate agreement, or on a purchase order shall be assumed to conform to the standards laid out in IPC-6012, IPC-A-600, IPC-9252, and IPC-1601 (current revision) for Assembly, Inspection, Test, and Packaging respectively. All criteria shall meet class 2 requirements, unless otherwise specified. NOTE: Customer specifications flowed down in drawings or purchase orders take precedent over these specifications.
All communication with WELLER must be directed through your respective buyer. Please don’t by-pass the buyer under any circumstances. If the buyer is not available, contact the purchasing manager directly.
Acceptance criteria not specifically detailed in customer documentation, this specification, in a separate agreement, or on a purchase order shall be assumed to conform to the standards laid out in IPC-6012, IPC-A-600, IPC-9252, and IPC-1601 (current revision) for Assembly, Inspection, Test, and Packaging respectively. All criteria shall meet class 2 requirements, unless otherwise specified. NOTE: Customer specifications flowed down in drawings or purchase orders take precedent over these specifications.
Any waivers or deviations to requirements will be clearly shown on the purchase order or written agreement. Such change requirements will be valid only for the product on the respective purchase order and will apply only to the number of boards requested on that order.
The supplier must make no changes to the materials or processes used to produce the product without written notification and agreement from WELLER. Should the PCB manufacturer make any such change without written approval, it will be responsible for all costs related to scrap, rework, re-qualification or other costs associated with any unauthorized change.
The Supplier shall inform WELLER of any missing, undefined, non-functional, or erroneous data in the PCB quote package. This shall include, but is not limited to CAD, Gerber, Netlist, and/or Panelization Data.
PCB Board panelization requirements are defined to meet the needs of our automated assembly equipment. Circuit Board layout, panelization, marking, etc. are generally intended to conform to typical industry standards.
All boards received shall meet Customer, WELLER, and Industry specifications for acceptability. In those rare occasions where “X-Out” boards need to be shipped, the following standards must apply.
X-Out is defined as a defective board that is a part of a panel array of boards. It has been tested and/or inspected and found to be out of specification by the manufacturer and is marked with an “X” on both sides of the board.
Panels that contain X-Out boards, if shipped, must be packaged separately, marked and grouped by board location in the panel. They must never be mixed intermittently with panels that have no X-Outs.
The total x-Out boards must be less than 10% or ordered quantities. The number of X-Out boards per panel must be limited and controlled by the PCB manufacturer, The chart below defines the standard of x-out per panel:
| # Boards Per Panel | Number of X-outs Allowed | % of Lot with X-Outs |
|---|---|---|
| 1-4 | 0 | 0 |
| 5-12 | 1 | 3% |
| 13-24 | 2 | 4% |
| >=24 | 3 | 5% |
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Unless otherwise specified: Board and Panel Marking: All marking shall be consistent from board-to-board and lot-to-lot and shall be of contrasting color, either etched into the copper layer or marked with epoxy ink.
All bare printed circuit board shall have a date code or lot code. If not allowed by customer design, or where not practical by size or layout, the date code or lot code shall be included on the panel frames.
All bare printed circuit board shall have inspection and/or test stamps to indicate acceptability. If not allowed by customer design, or where not practical by size or layout, the stamps shall be included on the panel frames.
Lead free printed circuit boards must be made with a specific material of at least 150C Tg and 325C Td.
All printed circuit board edges must be smooth and free of fibers, burs. Boards must be clean and free of dust.
Fiducial mark size shall be 1.0 to 1.5mm with a 3.00mm clearance area. The preferred location of fiducials is on the board image. It is acceptable to place fiducials on the panel frame. At a minimum, 2 diagonally opposed fiducials are required within the panel frame presented to the machine alignment cameras. Three non-symmetrical fiducials are preferred. Fiducial marks must be flat within 0.06% and consist of exposed metal, not masked.
Each shipment must be packed in a manner to minimize any risk of damage and in accordance with IPC-1601 (current rev) and J-STD-033 (current rev.), with recommended weight 15kg (max) per box. Shipments must use only the mode of transportation that is referenced on the purchase order unless specifically changed by the buyer. If the printed circuit boards have a silver finish, packaged boards or panels shall be protected in silver protecting paper and shipped in moisture barrier bags without desiccant to prevent tarnish. Shipments shall include:
Each shipment must be packed in a manner to minimize any risk of damage and in accordance with IPC-1601 (current rev) and J-STD-033 (current rev.), with recommended weight 15kg (max) per box. Shipments must use only the mode of transportation that is referenced on the purchase order unless specifically changed by the buyer. If the printed circuit boards have a silver finish, packaged boards or panels shall be protected in silver protecting paper and shipped in moisture barrier bags without desiccant to prevent tarnish. Shipments shall include:
