PCB Fabrication
Also known as a capped via, this technique involves plating over the via hole to create a fully metalized surface. A minimum copper plating thickness of 5μm is required for Class 2, while Class 3 demands 12μm.
Due to the increasingly development of new generation electronics from industry 4.0, 5G technology and AI application, more and more electronics devices are smaller and smaller but working on high speed computing, this requires the base circuit board must be load much more components at smallest size than before. Via in Pad is a solution to the challenge of optimizing the printed circuit board size.
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Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
When it comes to PCB layout, or printed circuit board manufacturing, Via in Pad is a special circuit board layout technology to increase PCB density, to allows higher PCB component density (especially in BGA area and SMT IC area). Many electronics engineering designers like to use via in pad technology to significantly save circuit board space so as to load as more components as possible.
When talk via in pad production process in PCB manufacturing process, it is a process to fill the via holes which locate in the solder PAD by resin (conductive or non-conductive), and then plating copper over these holes and it’s pad and then coating surface finishing. This will make sure the finished PAD without any holes to leak the solder pasting in the PCB assembly process. This technology mostly used in some circuit boards with high precise BGA components assembled, or some PCB board with limited smaller over size and over thickness required.
The best results for you
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
086 (0755) 2828 2776
Enables shorter, more direct signal paths by eliminating escape routing constraints.
Improves heat dissipation through direct thermal transfer from pads to inner layers or ground planes.
Minimizes parasitic inductance in RF/high-speed PCBs by shortening via stubs and current return paths.
Provides a planarized pad surface (via capping) for reliable solder joint formation with fine-pitch components like BGAs.
Reduces layer count by optimizing space utilization, lowering fabrication costs.
Saves board area by eliminating via keep-out zones, enabling denser layouts.
Allows thinner designs by reducing the need for through-hole vias or additional layers.
Supports more components per unit area compared to traditional via-on-pad designs.
Complex manufacturing processes (e.g., laser drilling, copper filling, planarization) increase production expenses compared to standard PCBs.
Low-quality plating or voids in capped vias may cause solder wicking, BGA pad detachment ("solder off"), or voiding during reflow.
Requires certified PCB fabricators with advanced equipment and process controls to ensure via integrity and plating consistency.
Left is the cost reference from through via holes,tented via holes,blind via holes… to Via in Pad for PCB design reference.
086 (0755) 2828 2776
086 (0755) 2828 2776
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Step 1: make the via holes as traditional through via holes.
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Step 2: filling the via holes by resin(conductive resin or non-conducive resin).
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Step 3: Plating copper over top side(or both side) of the via holes and it’s Pads, to make sure the via hole to be plated as “shut up”.
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Step 4: Surface finishing treatment over the Pad.
Following the design suggestion below or contact us freely when you need to perform a PCB layout on via in pad type.
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