PCB Fabrication
High-performance PCB manufacturing starts with optimized laminate and prepreg material selection.
Weller uses IPC-4101 compliant and 100% UL-certified materials for all PCB manufacturing, including:
We never compromise quality with uncertified or substandard materials—every layer meets stringent reliability standards.
The table below summarizes key characteristics from IPC-4101 classifications for rigid and multilayer PCB base materials:
| IPC-4101 | /99 | /101 | /121 | /124 | /126 | /127 | /127 | /129 | /130 |
| Tg (min) C | 150 | 110 | 110 | 150 | 170 | 110 | 150 | 170 | 170 |
| Td (min) C | 325 | 310 | 310 | 325 | 340 | 310 | 325 | 340 | 340 |
| CTE Z 50-260 C | 3.5% | 4.0% | 4.0% | 3.5% | 3.0% | 40.% | 3.5% | 3.5% | 3.0% |
| T260 (min) minutes | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| T288 (min) minutes | 5 | 5 | 5 | 5 | 15 | 5 | 5 | 15 | 15 |
| Fillers > 5% | Yes | Yes | NA | NA | Yes | Yes | Yes | NA | Yes |
| Dk/Permittivity (max) | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 | 5.4 |
If you have a good experience of a material which you know works for your product, you can send it to us as a reference.
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
When evaluating PCB base materials, prioritize both:
Selecting optimal PCB base materials requires evaluating both mechanical properties (especially thermal performance during soldering and heat cycling) and electrical characteristics – these critical factors determine material selection for standard applications. All referenced materials meet stringent UL V-0 flammability standards as a baseline requirement.
01
This is a measure of how much the base material will expand when heated. Measured as PPM/degree C (both before and after Tg) and also in % over a temperature range. Typical Low CTE High Tg PCB Material EM-827 827B
02
This is the temperature at which material weight changes by 5%. This parameter determines the thermal survivability of the material.
03
The temperature at which the material stops acting like a rigid material and begins to behave like a plastic / softer.
04
This is the time it take for the base material to delaminate when subjected to a temperature of 260 degrees C.
05
This is the time it take for the base material to delaminate when subjected to a temperature of 288 degrees C.
06
The ratio of the capacitance using that material as a dielectric, compared to a similar capacitor which has a vacuum as its dielectric.
07
A measure of the electrical breakdown properties of an insulating material. It is used for electrical safety assessment of electrical apparatus.
The normal CTI material as High CTI CEM-3 equivalent to FR-4.0: S2126, High thermal resistance: High CTI S3116;
S1600;
Autolad2GB, strongly recommended.
| Tracking Index (V) | PLC |
| 600 and greater | 0 |
| 400 through 599 | 1 |
| 250 through 399 | 2 |
| 175 through 249 | 3 |
| 100 through 174 | 4 |
| < 100 | 5 |
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
| Brand | Part number | Tg℃ | Td℃ | T260 (min) | T288 (min) | T300 (min) | Thermal Stress (288℃, solder dip) | CTI | Type | Remark |
| Shengyi | S1141 | 140 | 310 | 15 | 2 | NA | >60s | PLC 3 | FR4 | Conventional FR-4 |
| Shengyi | S1141 150 | 150 | 310 | 15 | 2 | NA | >60s | PLC 3 | FR4 | Conventional FR-4 |
| Shengyi | S1000H | 155 | 348 | >60 | 20 | NA | >100s | PLC 3 | FR4 | High Performance, Mid-Tg, Lead-free |
| Shengyi | S1000-2 | 180 | 345 | >60 | 20 | 5 | >100s | PLC 3 | FR4 | High Tg, Low CTE |
| Shengyi | S1000-2M | 185 | 355 | >60 | 30 | 15 | >100s | PLC 3 | FR4 | High Tg, High Performance, Low CTE |
| Shengyi | S1600 | 135 | 310 | 15 | 2 | NA | >100s | PLC 0 (≥600V) | FR4 | High CTI@PLC 0 (≥600V) |
| Shengyi | S1150G | 155 | 355 | >60 | 45 | NA | >100s | NA | FR4 | Halogen-free, Mid-Tg |
| ITEQ | IT-158 | 155 | 345 | >60 | 20 | NA | >10s | NA | FR4 | Middle Tg, Lead Free |
| ITEQ | IT-180A | 175 | 345 | >60 | 20 | NA | >10s | NA | FR4 | High Tg,Lead Free |
| Kingboard | KB-6160 | 130 | 305 | 10 | NA | NA | >10s | NA | FR4 | IPC-4101C/21 specification is applicable |
| Kingboard | KB-6165 | ≥150 | ≥325 | ≥30 | ≥10 | NA | ≥60s | NA | FR4 | Low CTE |
| Kingboard | KB-6167G | ≥170 | ≥340 | ≥30 | ≥15 | NA | ≥60s | NA | FR4 | UV Blocking and AOI ompatible, Halogen-free |
| Kingboard | KB-6160F | ≥130 | 313 | >10 | NA | NA | ≥10s | ≥175 | FR4 | UV Blocking, IPC-4101E/97, Low CTE |
| Kingboard | KB-6160 | ≥130 | 305 | >10 | NA | NA | ≥10s | ≥175 | FR4 | IPC-4101E/21, UV Blocking and AOI compatible |
| Kingboard | KB-6160A | ≥130 | 305 | >10 | NA | NA | ≥10s | ≥175 | FR4 | IPC-4101E/21; UV Blocking and AOI compatible |
| Kingboard | KB-6160C | ≥130 | 314 | >20 | NA | NA | ≥10s | ≥600 | FR4 | IPC-4101E/97, CTI≥600 |
| NAN YA | NP-140TL | 140 ± 5 | 310 | >10 | NA | NA | >10s | NA | FR4 | HTE copper foil |
| NAN YA | NP-150TL | 150 ± 5 | 314 | >10 | NA | NA | >10s | NA | FR4 | HTE copper foil |
| NAN YA | NP-170TL | 170 ± 5 | NA | NA | NA | NA | >10s | NA | FR4 | IPC-4101B |
| NAN YA | NP-180TL | 175 ± 5 | NA | NA | NA | NA | >10s | NA | FR4 | High Tg 175℃ |
| Isola | FR406 | 170 | 300 | 10 | >2 | NA | >10s | 0.3-0.4 | FR4 | |
| Isola | FR408 | 180 | 360 | 60 | 15 | NA | >10s | 0.4 | FR4 | A high-performance FR-4 epoxy laminate and prepreg |
| Isola | 370HR | 180 | 340 | 60 | 30 | NA | >10s | – | FR4 | The industry’s “best in class” lead-free compatible product |
| Isola | IS410 | 180 | 350 | 50 | 10 | NA | >10s | 0.5 | FR4 | Superior performance through multiple thermal excursions – passes 6x @ 288°C |
The best results for you
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
| Brand | Part number | Dielectric Constant (@10 GHz/23°C) | Tg | Td | Thermal Conductivity (@W/m/°K) | Remark |
| Rogers | RO4350B | 3.38 ± 0.05 | >280 | 390 | 0.64 | |
| Rogers | RO4003C | 3.48 ± 0.05 | >280 | 425 | 0.62 | |
| Rogers | TMM3 | 3.27 ± 0.032 | >280 | 425 | 0.70 | |
| Rogers | TMM4 | 4.50 ± 0.045 | >280 | 425 | 0.70 | |
| Rogers | TMM6 | 6.00 ± 0.080 | >280 | 425 | 0.72 | |
| Rogers | TMM10 | 9.20 ± 0.230 | >280 | 425 | 0.76 | |
| Rogers | MM10I | 9.80 ± 0.245 | >280 | 425 | 0.76 | |
| Rogers | TMM13i | 12.85 ±0.35 | >280 | 425 | – | |
| Rogers | RT/duroid® 600 | 6.15± 0.15 | >280 | 500 | 0.49 | |
| Taconic | TLC-27 | 2.75+/-0.05 | Tg>180 | – | 0.24 | |
| Taconic | TLC-30 | 3.00+/-0.05 | Tg>180 | – | 0.24 | |
| Taconic | TLC-32 | 3.20+/-0.05 | Tg>180 | – | 0.24 | |
| Taconic | TLE-95 | 3.00 +/– 0.05 | Tg>180 | – | 0.20 | Dielectric Thickness: 0.13mm |
| Taconic | TLE-95 | 2.95+/– 0.05 | Tg>180 | – | 0.20 | Dielectric Thickness: 0.25-0.80mm |
| Taconic | TLT-0 | 2.45+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-9 | 2.50+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-8 | 2.55+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-7 | 2.60+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLT-6 | 2.65+/- 0.05 @1MHz | Tg>180 | – | 0.19 | |
| Taconic | TLX-0 | 2.45+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-9 | 2.50+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-8 | 2.55+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-7 | 2.60+/- 0.04 | Tg>180 | – | 0.19 | |
| Taconic | TLX-6 | 2.65+/- 0.04 | Tg>180 | – | 0.19 |
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
| Brand | Part number | Tg (°C) | Td(°C) | Remark | ||
|---|---|---|---|---|---|---|
| Nelco | 4.2 | 185 | 350 | 0.46 | Advanced Lead-Free, High-Tg Multifunctional Epoxy | |
| Nelco | 4.1 (@ 1 GHz (RF Impedance)) | 175 | 325 | 0.3 – 0.4 | High-Tg Multifunctional Epoxy Laminate & Prepreg | |
| Nelco | 3.6 | 210 | 350 | 0.35 | High-Speed Multifunctional Epoxy Laminate & Prepreg | |
| Panasonic | 3.6 | 245 | _ | 0.6 | High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials | |
| Panasonic | 4.4 (@ 1 GHz (RF Impedance)) | 163 | 345 | – | High Tg & Low CTE type | |
| TUC Taiwan | 3.80 | 200 | 340 | – | Excellent application on Backpanel, High performance computing | |
| TUC Taiwan | 3.80 | 200 | 340 | – | Excellent application on Backpanel, High performance computing | |
| Rogers | 6.15 ± 0.15 | 280(min) | 407°C | – | Excellent application on Backpanel, High performance computing |
Data source: Weller PCB Material Database | Last updated: 2025
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
| Brand | Part number | Thermal Conductivity (W/(m·K)) | Tg(℃) | Td(℃) | Thermal Stress (288℃, solder float) min | Hi-pot Test (AC.V) | CTI | Remark |
| Shengyi | SAR15 | 1.5 | 140 | 380 | 30 | 3000 | PLC0 | Mid-power LED lighting LED TV Power supply board |
| ITEQ | IT-859GTA | 3.0 | 100 | 380(≥0.5mm) | >60(≥0.5mm) | 1000 | – | IPC-4101C Spec/21;Notebook Light Bar;LED Lighting Application;LCD TV Light Bar;Automobile Lighting;Traffic Lighting;Street Lamp and Lighting |
| Bergquist | MP-06503 | 1.30 | 90 | 325 | – | 2800 | High watt-density applications where achieving low thermal resistance is required |
| Brand | Part number | Dielectric Constant (@1 MHz) | Tg | Solder Float @10 sec at 288°C (550°F) | UL | Remark |
| Taiflex | MHK3025 | – | – | Pass | – | Halogen Free |
| DuPont | PYRALUX AC | 3.7 | – | Pass | 94V-0 | Excellent thermal resistance |
| DuPont | PYRALUX AP | 3.2(@10GHz) | 220 | Pass | V-0 VTM-0 | IPC slash sheet: 4204/11; Halogen Free: Yes 4 hours |
| DuPont | FR7012 (FR-xxxx) | 3.5 | – | Pass | UL746E | |
| Thin Flex | A-2005ED | 3.3 | 350 | Pass | 94V-0 | |
| Thin Flex | J-0505ED | 3.3 (@1GHz) | 350 | Pass | 94V-0 |
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
www.syst.com.cn
www.kingboard.com
For PCBs operating at high voltage, high current, or transmitting high-speed/high-frequency signals, partner with a specialized PCB manufacturer and select premium laminate materials – not the cheapest option – to prevent failures and ensure long-term reliability.
