PCB Assembly
Printed Circuit Board Assembly (PCBA) potting with epoxy resin delivers essential environmental protection. Shield electronics from water ingress, chemical exposure, mechanical shock, damaging vibration, voltage spikes, and physical damage for enhanced reliability.
Protect PCB Assemblies with Potting & Encapsulation
Electronic potting and encapsulation involve sealing a circuit board with protective compounds to safeguard against moisture, chemicals, shock, vibration, dust, and tampering. This process enhances durability while preventing reverse engineering and physical damage. Common potting materials include epoxy resin, silicone, and polyurethane, applied via automated equipment or manual methods for precision results.
WELLER Offers End-to-End PCB Potting Solutions
From PCB fabrication and assembly to firmware testing, box build assembly, and final potting, WELLER delivers full-turnkey solutions. Whether you need prototype validation or high-volume production, our experts help select the optimal encapsulation material (epoxy, silicone, or polyurethane) for superior reliability and longevity.
Weller offer potting and encapsulation for a variety of components. Our additional potting and encapsulation services include:
We also provide free assistance in the design of special housing, enclosure, shells, other casing for your electronic assemblies to add a further level of security. Each assembly we work with is thoroughly inspected and, if necessarily, each cleaned before coating to guarantee uniform adhesion. We also rigorously perform functional testing before and after the potting or encapsulations to ensure the uniform quality.
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
Except the specific requirement from customer, WELLER offers a variety of alternative materials for your electronic encapsulation and potting requirement needs, including silicone coatings, epoxy coatings, urethane coatings, and, to a lesser extent, acrylic coatings. And there are several alternative materials supplier for your selecting.
086 (0755) 2828 2776
Epoxy coatings are an ideal for protection of harsh environments and physical security, and are tailored to the specific requirement of your application, such as high voltage, thermal concerns, etc.
Silicone potting and silicone encapsulation provide excellent protection against moisture exposure and use a more forgiving material which can protect assemblies from stress and allows for movement.
Urethane coatings also have good performance in extreme environmental conditions, but they aren’t as hard and put less physical stress on the protected assemblies.
Silicone potting and encapsulating processes can provide an even higher level of production to electronic assemblies. The electronic devices encapsulated by this method will have highly resistant to environmental contaminants and even directly pressure cleaning and act us a support or cushion system for LED components package.
Generally, acrylic coatings are a quick-drying solution for protecting printed circuit board assemblies from moisture and environmental impact.
The best results for you
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
Not only providing standard electronic potting and encapsulation services, we can support customized potting process to meet customer’s some particular needs. Today, the typical electronic potting and encapsulation applications include but are not limited to:
Comparing with conformal coating, potting and encapsulation can provide a thicker and more robust on your electronic assemblies from harsher environments, and keep the their reliability and durability properly for longer lengths of time. Below is some typical advantages with electronic potting and encapsulation:
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
Encapsulating and potting PCB assemblies requires a highly experienced expertise to ensure consistent and repeatable results. It must be paid special attention to the procedures to ensure that that resin is applied at the correct temperature, and that correct resin-to-hardener ratio is used to achieve the desired results. Coatings material must also be properly mixed and dispensed to produce a smooth, even coating. Coatings must also be mixed and dispensed properly so as to produce a smooth, even coating.
Our factory develops several unique processes for electronic assemblies potting and encapsulation, and we always keep following latest technique standards to upgrade our production process. For some PCB assemblies only need specific area being coated not complete coating, special tools such as fence & fill application need to be designed to meet this requirement. This solution can meet high-quality but achieve low-cost.
In order to provide global support behind our customers, WELLER strives to remain on the cutting edge of electronic manufacturing and assembly, as well as potting and encapsulation technology.
Our Commitment to Excellence
– Rigorous quality control for IPC-CC-830B compliant coatings and UL-recognized potting compounds.
– Continuous R&D in automated coating application and defect prevention to reduce rework.
– Transparent communication, DFM feedback, and tailored solutions for automotive, aerospace, and industrial PCBA protection.
– Data-driven optimization to empower your supply chain and our team.
