PCB Fabrication
WELLER is your trusted flexible PCB manufacturer specializing in advanced rigid-flex manufacturing solutions and specialized materials (polyimide, LCP, DuPont) for high-reliability applications.
WELLER is your premier flexible PCB manufacturing partner, specializing in high-performance rigid-flex solutions for mission-critical applications. Our IPC-certified production capabilities deliver:
48-hour turnaround for complex multilayer flex designs
Polyimide, LCP, and Rogers® substrates for extreme environments
Scalable solutions with consistent IPC-6013 Class 3 quality
Complimentary DFM analysis for optimal flex circuit performance
Contact our flex PCB specialists today for a risk-free design consultation and quote.
| Item | Product | Standard Flex Circuits | Standard Rigid-flex Circuits | High Density Interconnect (HDI) Flex Circuits |
|---|---|---|---|---|
| 01 | Standard Panel Size | 250mm x 400 mm | 100mm x 100mm | 250mm x 400mm |
| 02 | Line Width and Spacing | .003″ (0.07mm) | .003″ (0.07mm) | .003″ (0.07mm) |
| 03 | Copper Thickness | >=1/2 oz | 1/4 to 1/2 oz. | >=1/2 oz |
| 04 | Layer Count | 10 | <=4 | <=8 |
| 05 | Minimum Drill (Mechanical) Hole Diameter | .008″ (0.2 mm) | .006″ (0.15 mm) | .008″ (0.2 mm) |
| 06 | Minimum Via (Laser) Size | 5.0mil (0.15 mm) | 1.0mil (0.025mm) | 6.0 mil (0.15 mm) |
| 07 | Minimum Micro Via (Laser) Size | 3.0 mil (0.07 mm) | 1.0 mil (0.025 mm) | 3.0 mil (0.07 mm) |
| 08 | Stiffener Material | Polyimide / FR4 / Metal | Polyimide / FR4 / Metal | Polyimide / FR4 |
| 09 | Shielding Material | Copper / Silver Ink / Tatsuta / Carbon | Copper / Silver Ink / Tatsuta / Carbon | Copper / Silver Ink / Tatsuta / Carbon |
| 10 | Via Tooling Tolerance | 2.0 mil (0.05 mm) | 1.0 mil (0.025 mm) | 2.0 mil (0.05 mm) |
| 11 | Zif Tolerance | 2.0 mil (0.05 mm) | 1.0 mil (0.025 mm) | 2.0 mil (0.05 mm) |
| 12 | Solder Mask Bridge Between Dam | 5.0 mil (0.13 mm) | 4.0 mil (0.11 mm) | 5.0 mil (0.13 mm) |
| 13 | Solder Mask Registration Tolerance | 4.0 mil (0.11 mm) | 4.0 mil (0.11 mm) | 5.0 mil (0.13 mm) |
| 14 | Coverlay Registration | 8.0 mil (0.20 mm) | 5.0 mil (0.13 mm) | 8.0 mil (0.20 mm) |
| 15 | Coverlay PIC Registration | 7.0 mil (0.18 mm) | 4.0 mil (0.11 mm) | 7.0 mil (0.18 mm) |
| 16 | Coverlay Solder Mask Registration | 5.0 mil (0.13 mm) | 4.0 mil (0.11 mm) | 5.0 mil (0.13 mm) |
| 17 | PI Stiffener Registration | 10.0 mil (0.25 mm） | 10.0 mil (0.25 mm） | 10.0 mil (0.25 mm） |
| 18 | PI Stiffener Thickness Tolerance | 10% | 10% | 10% |
| 19 | FR4 Stiffener Registration | 10.0 mil (0.25 mm） | 10.0 mil (0.25 mm） | 10.0 mil (0.25 mm） |
| 20 | FR4 Thickness Registration | 10% | 10% | 10% |
| 21 | Legend Minimum Height | 35.0 mil (0.89 mm) | 25.0 mil (0.64 mm) | 35.0 mil (0.89 mm) |
| 22 | Legend Minimum Width | 8.0 mil (0.20 mm) | 6.0 mil (0.15 mm) | 8.0 mil (0.20 mm) |
| 23 | Legend Minimum Space | 8.0 mil (0.20 mm) | 6.0 mil (0.15 mm) | 8.0 mil (0.20 mm) |
| 24 | Legend Registration | +/- 5 mil (0.13 mm) | +/- 5 mil (0.13 mm) | +/- 5 mil (0.13 mm) |
| 25 | Legend Impedance | +/- 10% | +/- 10% | +/- 10% |
| 26 | Steel Rule Die Outline Tolerance | 5.0 mil (0.13 mm) | 2.0 mil (0.051 mm) | 5 mil (0.13 mm) |
| 27 | Steel Rule Die Minimum Radius | 5.0 mil (0.13 mm) | 4.0 mil (0.11 mm) | 5.0 mil (0.13 mm) |
| 28 | Steel Rule Die Inside Radius | 20.0 mil (0.51 mm) | 10.0 mil (0.25 mm) | 31.0 mil (0.79 mm) |
| 29 | Steel Rule Die Punch Minimum Hole Size | 40.0 mil (1.02 mm) | 31.5 mil (0.80 mm) | N/A |
| 30 | Steel Rule Die Tolerance of Punch Hole Size | +/- 2 mil (0.051 mm) | +/- 1 mil (0.025 mm) | 31 mil (0.79 mm) |
| 31 | Steel Rule Die Slot Width | 20.0 mil (0.51 mm) | 15.0 mil (0.38 mm) | 31.0 mil (0.79 mm) |
| 32 | Steel Rule Die Tolerance of Hole to Outline | +/- 3 mil (0.07 mm) | +/- 2 mil (0.051 mm) | +/- 4 mil (0.11 mm) |
| 33 | Steel Rule Die Tolerance of Hole Edge to Outline | +/- 4 mil (0.11 mm) | +/- 3 mil (0.07 mm) | +/- 5 mil (0.13 mm) |
| 34 | Steel Rule Die Minimum of Trace to Outline | 8.0 mil (0.20 mm) | 5.0 mil (0.13 mm) | 10.0 mil (0.25 mm) |
Our engineering team is ready to assist with your:
DFM guidance for complex layouts
Multilayer flex up to 20 layers
Polyimide, LCP, and high-frequency substrates
Component sourcing and testing
As your one-stop Flex PCB supplier, we streamline the entire process from design to delivery.
