Quote

PCB Fabrication

HDI PCB Manufacturing Capability

HDI PCB, defined by IPC-2226 as a printed circuit board with a higher circuitry density per unit area opposed to traditional circuit board.

What is HDI PCB?

HDI (High-Density Interconnect) PCB, classified under IPC-2226 standards, represents the next generation of printed circuit boards. Unlike traditional PCBs, HDI technology delivers:

Key Features of HDI  Printed Circuit boards

  • Higher circuitry density per unit area (8-20+ layers in compact designs)
  • Microvias (<150μm diameter) enabling complex multilayer routing
  • Thinner trace widths/spacing (down to 2/2 mil)
  • Improved signal integrity for high-frequency applications

Key Advantages Over Conventional PCBs:

  • Space Optimization: 60%+ size reduction vs. standard boards
  • Enhanced Performance: Lower inductance/crosstalk with blind/buried vias
  • Reliability: Sequential lamination and advanced materials (e.g., Megtron 6)

Industry Applications Demanding HDI:

  • 5G Communications
  • Medical Implants
  • Aerospace Avionics
  • Automotive ADAS
  • Wearable Technology
  • Military Electronics

You can customize your HDI PCBs utilizing the best options from the list below.

ItemCapabilityPrototypeMass Production
01Base MaterialFR4, Halogen Free, RCC, Ulta Thin Core, RF.FR4, Halogen Free, RCC, Ulta Thin Core, RF.
02Surface TreatmentENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSPENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP
03Min. Line/Spacing2.0/2.0mil3.0/3.0mil
04Critical Line Width Tolerance2.5mil±15%2.0mil±10%
05Min.Microvia Drill Size (Laser)4.0 mil4.0 mil
06Min.Capture/Target Pad Size10.0 mil10.0 mil
07Min PTH & Buried Drill Bit0.20 mm0.20 mm
08Min. Annular Ring3.5mil3.0mil
09Max. PTH Aspect Ratio10:112:1
10Max. Microvia Aspect Ratio0.8:10.8:1
11Single ended impedance50 – 90 ohms: +/- 8% (but no less than 4 ohm)50 – 90 ohms: +/- 8% (but no less than 4 ohm)
12Differential impedance100 – 155 ohms: +/- 10%100 – 155 ohms: +/- 10%
13Solder Mask Clearance1.5 mil1.5 mil
14Solder Mask Dam2.5 mil2.5 mil
15Min. BGA/CSP pitch0.4 mm0.4 mm
16Registration from Layer to Layer2.0 mil2.0 mil
17Min. dielectric thickness1.8 mil2.0 mil
18PTH Hole Tolerance+/- 2mil+/- 3mil
19Min. Outline Tolerance±0.1mm±0.1mm
20Min. Core Thickness3.0 mil3.0 mil
21Hole StructureStagger Vias, Stacked Via, Skip Via, Stepped Via, ELICStagger Vias, Stacked Via, Skip Via, Stepped Via, ELIC
22HDI type I…IV (IPC-2226A)1+n+1 … 4+n+45+n+5 … 9+n+9; Stacked µVia; Any layer µVia
23Other TechnologyCarbon Jumper, LDI, DLD, Copper Filled Via, VOPCarbon Jumper, LDI, DLD, Copper Filled Via, VOP
Why Partner with WELLER for HDI PCBs?

  • IPC-6012 Class 3 Certified Manufacturing
  • 25μm Laser Drilling Precision
  • Impedance Control (±5%)
  • Rigorous Testing: TDR, Cross-Section Analysis

Have any technical questions?

  • Guaranteed expert response within 4 hours
Laser-drilled microvia HDI PCB technology