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Via Current Calculator

Via Current Calculator: Estimate the current-carrying capacity of your printed circuit board vias using our approximation tool. Ideal for initial design checks, it applies standard IPC guidelines for plating thickness and drill size.

This essential tool empowers you to accurately determine the ​​current carrying capacity of vias​​, a critical factor in preventing overheating and ensuring board integrity. Simply input key parameters like via diameter, plating thickness, and operating temperature.

Our calculator instantly computes vital metrics including ​​via resistance, voltage drop, and power loss​​, accounting for material properties and thermal effects. Streamline your design workflow, enhance ​​printed circuit board reliability​​, and make confident decisions with this indispensable engineering resource.

Please contact our experts to ensure your design is manufacturable at scale.

  • Approximation Formula: The result is a close approximation and should not be solely relied upon for designs where a high degree of accuracy is critical.

  • For High-Accuracy Needs: We recommend using this data for initial planning and performing detailed simulation or consulting IPC standards for final validation.

Calculation Parameters & Industry Standards:
This calculator is based on common PCB manufacturing standards:

  • Copper Plating Thickness: A nominal value of 1.0 mil.

  • Drill Size: Calculated as:

    • Final Via Hole Size + 4.0 mil (for non-HASL or HAL LF surface finishing).

    • Final Via Hole Size + 4.5 mil (for HASL surface finishing).

Interface of the PCB Via Current Calculator showing input parameters and results for via current carrying capacity.
Via Drill size before plating: D
Maximum temperature rise above ambient: ▲T
Via plating thickness: tp (Default Value: 1.37795 Mils=1Oz)
Required Current for Single Net: Imax

Results

Maximum current in Amps: Imax
Minimum no of Via's Required: Vno

CALCULATOR