PCB Assembly
Underfill is a critical PCBA encapsulation technique where a specialized epoxy resin or polymer adhesive is dispensed and cured to fill the microscopic gaps beneath semiconductor components (like flip chips, BGAs, or CSPs) and the PCB substrate.
Underfill technology is a critical PCBA protection method that safeguards semiconductor devices (such as flip chips, BGAs, and CSPs) from mechanical stress, including shock, drop, and vibration. Additionally, it minimizes solder joint strain caused by CTE (Coefficient of Thermal Expansion) mismatch between the silicon die (chip) and the PCB substrate—two materials with different thermal expansion rates.
The underfill material—a specialized liquid polymer adhesive—is dispensed onto the populated PCB after reflow soldering. Once applied, the underfill epoxy flows via capillary action, filling the microscopic gaps beneath the semiconductor component. After dispensing, the underfill undergoes thermal or UV curing, forming a rigid encapsulation layer that reinforces the interconnect solder joints between the chip’s underside and the PCB’s surface.
The best results for you
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
Five Steps
Because there are at least 50 different designs of CSP(chip scale package), plus a numbers of variables and operating conditions involved in interconnect design, it is difficult to provide a specific definition for when to use underfill. However, there are a myriad of key factors that should be taken into account when starting a PCB design. Including some of the critical factors:
086 (0755) 2828 2776
Typical PCB material has a CTE of 16ppm; silicon of the die has a CTE of 2.4 ppm. Generally ceramic materials can be designed to have a matching CTE but 95% alumina ceramic has a CTE of 6.3 ppm. Although underfill proved much reliability on ceramic substrates, it has greater needs on PCB-based packages. An alternative solution is to use an interposer substrate as a shock absorber between the chip and the main substrate, such as flexible or high-CTE ceramic materials, which can reduce the impact that due to the CTE differences between PCB and silicon die.
Generally, the larger the die area take along with the greater strain-induced problems. For example, one study proved that once the die size increased from 6.4 to 9.5mm, the number of temperature cycles from -40° to 125°C that the interconnect could withstand decreased from 1,500 to 900 cycles.
The solder ball size and layout of the chip play a critical role in the underfill evaluation because larger ball sizes, such as ball size in diameter with 300µ that are typically used with CSPs, these are more robust and can handle stress and strain much better than the 75u diameters balls used with flip chips. Assuming the relative sheer strain displacement of a two-member joint is similar in CSP and flip chip, then strain withstood by the CSP solder joint is approximately a quarter of that experienced by a flip chip. Therefore, the chips designer originally thought that the CSP solder ball structure itself could afford the mechanical strains associated with PCB substrate and die thermal expansion. A serial of studies have shown that underfill offers an excellent reliability benefit with CSPs, particularly in some portable applications. On the layout handling, some electronic designers have found that increasing the size of the lands at the chip corners can improve strain resistance, but this is not always a practical or sufficient option to achieve reliability goals.
Experiments have shown that thicker PCBs are stiffer and resist bending forces from impact shock more than thinner circuit boards. For example, some analysis has demonstrated that an increase of FR-4 substrate thickness from 0.6 to 1.6 mm could improve cycles-to-failure from 600 to 900 cycles. Unfortunately, the reality in many of today’s miniature electrical devices is that it is often limited to increase substrate thickness. In practice, each doubling of substrate thickness can provide approximately a 2 times of improvement in reliability, but a doubling of die size will impose a 4 times of degradation.
In the final analysis, the decisive factor generally have to do with increasing expectations for survivability. For example about the the specifications on hand-held devices (cell phones, pagers, etc.), it is becoming common to call for normal functioning after thermal cycling between -40° to 125°C for 1,000 cycles and survivability after 20 to 30 drops from 1 m onto a concrete floor.
Some researches on thermal cycling show that using underfill can improve the number of -40°C to 125°C temperature cycles to be 2 to 4X. These temperature cycles that can be explored prior to exhibiting failure modes, with some assemblies handled with underfilling still not failing after as many as 2,000 cycles. When compared with the actual costs of field failures (e.g. returns, loss of reputation, etc.) for devices exposed to increasingly harsh environments, many manufacturers are actively considering to use underfill as a reliability insurance method.
086 (0755) 2828 2776
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
When it comes to decide to use underfill technology to handle the chips package on electronics assembly, a range of challenges need to be taken into account to efficiently implement the process to achieve consistently reliable and durability results while maintaining required mass production throughput levels. Some of critical issues including:
