PCB ASSEMBLY
Full Printed Circuit Board Assembly Capability – delivering global electronics manufacturing support with advanced PCB fabrication, streamlined component sourcing, and comprehensive functional testing.
Weller Technology offers an extensive broad arrange of electrical and electro-mechanical and PCB (rigid PCB and flex PCB) manufacturing services. These services can include pre-engineering, PCB SMD assembly, PCB PTH assembly, design for maneuverability (DFM) support, design for test (DFT), compliance testing, final packaging, and logistics optimizing services.
Innovation and investment in keeping Weller at the cutting edge helps maintain our position as a professional electronic industry leader in the manufacturing field of small volume and quick turns.
Our state of the art 4000 square meters electronic assembly facility contains an impressive list of equipment including over 1000 square meters medical clean room. Our PCB assembly capabilities include:
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Resistors, caps, diodes,Sips, Dips, IC, BGA, LED, Connetcors, Headers, some through hole parts, etc.
(0.254 x 0.13mm ) 01005 – 100 x 45mm (3.94 x 1.77″)
.005 – 2.00″
Flex, Rigid-flex, RF, CEM, Aluminum, Copper base
Lead-free, water soluble, rosin, No-clean, etc.
100″ x .100″ min (Pallets) – 30″ x 30″ max
.010″(Fiber) (1mill Flex) min – .500″ max
2D, Laser
Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), No Clean etc.
Available Brand:
Aalpha Paste: ALPHA OM-340;
Indium Paste:
Low voids indium-8.9HF;
Koki Paste: Low voids S3X58-HF1100-3;
22,000
Capacitors, resistors, diodes, jumpers, etc
0.300″min – 0.950″max
0.100″ min – 0.460″ width max
0.100″ min – 0.460″ width max
0.015’min – 0.032″max
2” x 2” Min – 22″ x 18.5″ Max
20″ x 18.5″
BEC feature compensation for PCB pattern errors
Flex, Rigid-flex, RF, CEM, Aluminum
Expandable range verifier (ERV) ensures operator accuracy of component loading
The best results for you
Don’t hesitate, contact us to start discussing your projects. We prioritize your inquiries and aim to respond within 12 hours.
4,500
.300 Dip & Sockets .600 Dip & Sockets
0.512″ x 0.512″ x 0.906″
2 x 2″ Min – 22′ x 18.5″ Max
.010 Min – 0.250″ Max
20″ x 18.5″
BEC feature compensation for PCB pattern errors
Expandable range verifier (ERV) ensures operator accuracy of component loading
Flex, Rigid-flex, RF, CEM, Aluminum
Manual, Mass wave, Seletcive,reflow
Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc.
VOC-free, Lead-free, water soluble, rosin, No-clean, etc.
Ultra sonic, spray, drop jet, foam, etc.
.100 x .100 min (Pallets) – 30″ x 30″ max
.010″ min – 1″ max
Selective soldering, Wave soldering
D-X-Ray, AOI Automatic Optical Inspection
255 times
Color & X-ray
100″ x.100 min – .30″ x 30″max
Firmware burn-in, Power up, cycle, Aging test, etc.
Synthesized Signal Generator, Frequency Synthesizers, etc.
24 probe, 35″ x 25″max
Windows 7,Windows 10, OS, Linux.
ST,Ateml,TI…etc
Passives (03015 on up), processors, BGA, etc.
Trace, via, through hole, smt, etc.
Axial, radial, dip, sip, transformers, connetcors, headers, etc.
Rigid wire, flex circuit, fiber optic, connetcors, etc.
Acrylic, silicon, UV, etc.
Available Brand:
DCA200H
AFA200
Humiseal-1B73(Meet IEC 60664-3)
Humiseal-1A33(Meet IEC 60664-3)
Capable of applying solvent and water based coatings, along with solids with accuracy of 0.001 inches
2×2″ -20×20″
4″
25-250 μm (normal: 50um)
2 part epoxy, Urethane, Silicone, conductive, non-conductive, under fills, etc.
Available Brand:
3M-DP270
Epic-S7302
Wiring, assembly, testing, labeling, shipping, etc.
World wide
100% component & product tracking
Hi-Tech sources only top quality components, including single, double and multi-layer boards, semiconductors, active and passive components, and electro-mechanical assemblies.
