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Author: Carl Zhu

A graduate of the Electronic Engineering department, with 30+ years of PCB layout experience, focusing on layouts for high-frequency and high-speed circuit boards.

3TG Conflict Material

3TG conflict minerals guide for PCB manufacturers and assemblies - tin tantalum tungsten gold sourcing compliance

What is 3TG Conflict Material? A Guide for PCB Manufacturers & Buyers In the world of electronics and PCB manufacturing and assembly, responsible sourcing is a growing priority. Regulations such as the U.S. Dodd‑Frank Act Section 1502 and the EU Conflict Minerals Regulation require companies to know exactly where their raw materials come from – […]

Any Layer HDI PCB – Enabling Next-Generation Electronics Manufacturing Services

Any Layer HDI PCB cross-section diagram showing stacked microvias, copper-filled vias, and 12-layer ELIC structure for high-density electronics manufacturing.

The relentless drive toward smaller, faster, and more intelligent electronic devices has pushed printed circuit board (PCB) technology to its limits. Among the most advanced solutions available today is Any Layer HDI (High Density Interconnect) PCB. Unlike conventional HDI, which limits microvias to adjacent layers, Any Layer HDI allows stacked microvias to connect any two […]