A Comprehensive Discussion on Common 4 Layer PCB Stack-Up Diagram Designs
There are general discussions on the laminated structure of multi-layer printed circuit boards, and most PCB factories have relevant training about this knowledge, which have thoroughly and clearly explained various laminated stack-up’s structures and principles.
PCB Potting Resins: Ultimate Protection for Electronic Assembly
Today the electronics industry is one of the most rapidly expanding industries in the world, with an almost unlimited range of applications. more and more printed circuit boards (PCBs) are found in many domestic, industrial, automotive and military devices and require protection from their environment.
PCB Controlled Impedance: Design, Calculation, Manufacturing & Testing
A practical guide to PCB controlled impedance covering trace geometry, stackup, materials, impedance calculation, manufacturing variation, differential pairs, TDR testing, and impedance coupons.
How to Choose Prepreg Dk Value When Design a PCB Stack-UP
The Prepreg in the PCB stack-up plays on a critical role on the circuit board’s durable reliability and operation performance. Especially some advanced PCB design with requiring strict dielectric thickness between circuit layers.
The Difference between IPC-6012, IPC-A-600, and IPC-A-610
IPC-A-600: Acceptance criteria for various types of printed circuit boards. IPC-6012 class 1, 2, 3, manufacturing and performance specifications for rigid printed circuit boards. IPC-A-610 is the criteria guiding the Acceptability of Electronics Assemblies.
Al Technology vs Electronic Design and Manufacturing
The integration of artificial intelligence (AI) in electronic manufacturing services has grown quickly in the industry. In PCB manufacturing, AI is used to carry out different tasks, and this has made the production process easier and more The integration of artificial intelligence (AI) in electronic manufacturing services has grown quickly in the industry.