PCB Base Material


Normally,all PCB base material used by Weller conform to IPC4101( specification for base materials for rigid and multilayer printed boards ) and UL certificated.

The table below is an extract of certain characteristics from IPC-4101 classifications, highlighting some of the details already referenced.

IPC-410199101121124126127128129130
Tg (min) C150110110150170110150170170
Td (min) C325310310325340310325340340
CTE Z 50-260 C3,5%4%4%3,50%3%4%3,50%3,50%3%
T260 (min) minutes303030303030303030
T288 (min) minutes555515551515
Fillers > 5%YesYesNANAYesYesYesNAYes
Dk/Permittivity (max)5,45,45,45,45,45,45,45,45,4

If you have experience of a material which you know works for your product, you can it to us as a reference.

Some key material characteristics

  • CTE – Z axis(Co-efficient of thermal expansion): This is a measure of how much the base material will expand when heated. Measured as PPM/degree C (both before and after Tg) and also in % over a temperature range. Typical Low CTE High Tg PCB Material EM-827 827B
  • Td (Decomposition temperature): This is the temperature at which material weight changes by 5%. This parameter determines the thermal survivability of the material.
  • Tg (Glass transition temperature): The temperature at which the material stops acting like a rigid material and begins to behave like a plastic / softer.
  • T260 (Time to delamination): This is the time it take for the base material to delaminate when subjected to a temperature of 260 degrees C.
  • T288 (Time to delamination): This is the time it take for the base material to delaminate when subjected to a temperature of 288 degrees C.
  • Dk (Dielectric constant): The ratio of the capacitance using that material as a dielectric, compared to a similar capacitor which has a vacuum as its dielectric.
  • CTI (Comparative tracking Index): A measure of the electrical breakdown properties of an insulating material. It is used for electrical safety assessment of electrical apparatus. The normal CTI material as High CTI CEM-3 equivalent to FR-4.0: S2126, High thermal resistance: High CTI S3116.

Our Standard PCB Laminate Material Source

StandardAdvancedFlexIMS
Sheng Yi
S1140 Tg 140
S1141 150 Tg 150
S1000-2 Tg 180
S1600 high CTI>
Rogers
Ro4350B Tg>280
TMM3,TMM4 Tg>280
MM6 TMM10 Tg>280
MM10i TMM13i Tg>280
RT/duroid® 600 Tg>280
Tai Flex
Taiflex_datasheet
Bergquist
MP-0653
Berguist-Series
ITEQ
IT-158 Tg150
IT-180A Tg180
Taconic
TLC Tg>180
TLE Tg>180
TLT Tg>180
TLX Tg>180
DuPont
PYRALUX AC(Polyimide)
PYRALUX AP(Polyimide)
FR7001,coverlay
ShengYi
SAR15 1.5W
Kingboard
KB-6160 Tg130
KB-6165 Tg150
KB-6167 Tg170
Isola
FR406,FR408
370HR,IS410
Thin Flex
A-2005ED Polyimide
W-0505ED polyimide
ITEQ
IT-859GTA
TUC Taiwan
TU-872 lk Tg220
Nelco
Nelco4000-29
N4000-6
Nelco4000-13
NanYa
NP-140TL, NP-150TL
NP-170TL,NP-180TL
Panasonic
R-5575-R5470
R1706_R-1755D

More information on PCB Laminates, visit the following websites.

Supplier NameWeb Link
SHENG YIwww.syst.com.cn
ROGERSwww.rogerscorp.com
ISOLAwww.isola-group.com
ITEQ www.iteq.com.tw
TACONICwww.taconic-add.com
NAN YA www.npc.com.tw
DUPONTwww.dupont.com
NELCO www.parkelectro.com
TAIFLEXwww.taiflex.com