6-Layer PCB Stackup Design: Complete Guidelines for Optimal Performance

admin_dHENb9
April 7, 2024
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The standard 6L layers PCB stackup is the most common options selected by PCB designers. The standard layer stack-up structures can be utilized in most applications.

As a standard option, you can get a variable 6 layer stack up from us, which is defined by following parameters:

Prepreg: All the prepreg selection refer S1000HB
Base material: Tg>=150 (Strongly recommend to avoid layers de-lamination issues)
PCB thickness: 0.7mm/0.8mm/1.0mm/1.6mm/2.0mm/2.4mm/3.0mm
Final finished copper thickness: 1/1/1/1/1/1oz (Note: the out layer copper thickness: base copper+plating copper)

6L, T=0.70mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=0.70mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	2116X1		Prepreg
IN1	2	Copper		35	Copper
		Core	FR4	60	Core


IN2	3	Copper		35	Copper
		Prepreg	2116X1		Prepreg
IN3	4	Copper		35	Copper
		Core	FR4	60	Core
		Core	FR4	60	Core
IN4	5	Copper		35	Copper
		Prepreg	2116X1		Prepreg
BOT	6	Copper		18	Base copper
BOT	6	Copper		18-25	Copper plating
SMB		Solder Mask		20	Solder Mask
	Nornimal PCB thickness: 0.7+/-0.10mm

6L, T=0.80mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=0.80mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	2116X1		Prepreg
IN1	2	Copper		35	Copper
		Core	FR4	60	Core


IN2	3	Copper		35	Copper
		Prepreg	7628X1		Prepreg
IN3	4	Copper		35	Copper
		Core	FR4	60	Core
		Core	FR4	60	Core
IN4	5	Copper		35	Copper
		Prepreg	2116X1		Prepreg
BOT	6	Copper		18	Base copper
BOT	6	Copper		18-25	Copper plating
SMB		Solder Mask		20	Solder Mask
	Nornimal PCB thickness: 0.80+/-0.10mm

6L, T=1.00mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=1.00mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	2116X1		Prepreg
IN1	2	Copper		35	Copper
		Core	FR4	140	Core


IN2	3	Copper		35	Copper
		Prepreg	7628X1		Prepreg
IN3	4	Copper		35	Copper
		Core	FR4	140	Core
		Core	FR4	140	Core
IN4	5	Copper		35	Copper
		Prepreg	2116X1		Prepreg
BOT	6	Copper		18	Base copper
BOT	6	Copper		18-25	Copper plating
SMB		Solder Mask		20	Solder Mask
	Nornimal PCB thickness: 1.00+/-0.10mm

6L, T=1.60mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=1.60mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	1080X1		Prepreg
		Prepreg	7628X1		Prepreg
IN1	2	Copper		35	Copper
		Core		290	Core
		Core		290	Core
IN2	3	Copper		35	Copper
		Prepreg	7628X1
IN3	4			35	Copper
		Core		290	Core
		Core		290	Core
IN4	5	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	1080X1		Prepreg
BOT	6			18	Base copper
BOT	6			18-25	Copper plating
				20	Solder Mask
	Nornimal PCB thickness: 1.60+/-0.16mm

6L, T=2.00mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=2.00mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	1080X1		Prepreg
		Prepreg	7628X1		Prepreg
IN1	2	Copper		35	Copper
		Core		440	Core
		Core		440	Core
IN2	3	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	7628X1		Prepreg
IN3	4			35	Copper
		Core		440	Core
		Core		440	Core
IN4	5	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	1080X1		Prepreg
BOT	6			18	Base copper
BOT	6			18-25	Copper plating
				20	Solder Mask
	Nornimal PCB thickness: 2.00+/-0.20mm

6L, T=2.40mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=2.40mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	1080X1		Prepreg
		Prepreg	7628X1		Prepreg
IN1	2	Copper		35	Copper
		Core		640	Core
		Core		640	Core
IN2	3	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	7628X1		Prepreg
IN3	4			35	Copper
		Core		640	Core
		Core		640	Core
IN4	5	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	1080X1		Prepreg
BOT	6			18	Base copper
BOT	6			18-25	Copper plating
				20	Solder Mask
	Nornimal PCB thickness: 2.40+/-0.24mm

6L, T=3.00mm, 1/1/1/1/1/1 oz

6L PCB Stack-Up T=3.00mm

	Layer			T: um	Material
SMT		Solder Mask		20	Solder Mask
Top	1	Copper		18-25	Copper plating
Top	1	Copper		18	Base copper
		Prepreg	1080X1		Prepreg
		Prepreg	7628X1		Prepreg
IN1	2	Copper		35	Copper
		Core		1130	Core
		Core		1130	Core
IN2	3	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	7628X1		Prepreg
IN3	4			35	Copper
		Core		1130	Core
		Core		1130	Core
IN4	5	Copper		35	Copper
		Prepreg	7628X1		Prepreg
		Prepreg	1080X1		Prepreg
BOT	6			18	Base copper
BOT	6			18-25	Copper plating
				20	Solder Mask
	Nornimal PCB thickness: 3.00+/-0.30mm

The stack-up options above represent our standard 6-layer PCB build-ups, featuring a final finished copper thickness of 1 oz per layer (1/1/1/1/1/1 oz). These configurations are engineered to deliver the optimal balance of manufacturing reliability, electrical performance, and production cost. For multi-layer PCBs exceeding 4 layers, we recommend using a Tg 150 substrate to mitigate potential quality issues during the high-temperature, lead-free assembly process, such as de-lamination or blistering.

If you require a customized multilayer PCB stack-up, impedance-controlled design, or a stack-up utilizing 2 oz or heavier copper, please forward your specifications to [email protected]. Our engineering team will provide a professional assessment within 2 to 4 hours.

Shengyi Prepreg S1000HB Reference

Based Material Line Up S1000H (S1000HB)-PREPREG (B-STAGE)

Glass style	RC (%) Nominal	Thickness		Dk				Df
Glass style	RC (%) Nominal	mm	mil	1GHz	3GHz	5GHz	10GHz	1 GHz	3 GHz	5 GHz	10 GHz
7628	43*	0.185	7.28	4.81	4.74	4.74	4.73	0.014	0.015	0.015	0.016
7628	46	0.195	7.68	4.74	4.68	4.66	4.66	0.015	0.016	0.016	0.016
7628	48	0.205	8.07	4.70	4.63	4.61	4.61	0.015	0.016	0.016	0.017
7628	50	0.215	8.46	4.65	4.58	4.57	4.57	0.016	0.016	0.017	0.017
7628	52	0.225	8.86	4.59	4.52	4.51	4.50	0.016	0.016	0.017	0.017
1506	48	0.160	6.30	4.70	4.63	4.61	4.61	0.015	0.016	0.016	0.017
1506	50	0.170	6.69	4.65	4.58	4.57	4.57	0.016	0.016	0.017	0.017
1506	52	0.180	7.09	4.59	4.52	4.51	4.50	0.016	0.016	0.017	0.017
2116	52*	0.113	4.45	4.59	4.52	4.51	4.50	0.016	0.016	0.017	0.017
2116	53*	0.116	4.57	4.57	4.50	4.49	4.48	0.016	0.017	0.017	0.018
2116	55	0.120	4.72	4.53	4.45	4.43	4.43	0.017	0.017	0.018	0.018
2116	58	0.130	5.12	4.45	4.38	4.36	4.36	0.017	0.018	0.018	0.018
3313	57	0.100	3.94	4.48	4.41	4.39	4.39	0.017	0.018	0.018	0.018
1080	65	0.072	2.83	4.29	4.21	4.19	4.18	0.019	0.019	0.019	0.020
1080	68	0.081	3.19	4.21	4.13	4.11	4.11	0.020	0.019	0.020	0.020
1080	70	0.087	3.43	4.16	4.08	4.05	4.05	0.020	0.019	0.020	0.020
106	73	0.050	1.97	4.09	4.01	3.97	3.97	0.020	0.020	0.020	0.020
106	78	0.063	2.14	3.97	3.89	3.83	3.83	0.02	0.021	0.020	0.022

Remark:
1) Test by SPDR method.
2) The data above show actual values and are not guaranteed, for your reference only.
3) RC* is not common type for reference.
4) Last update: Oct, 2020