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4-Layer PCB Stackup Design: Complete Guidelines for Optimal Performance

standard-4-layer-PCB-Stack-up-Design-Guidelines-and-options

The standard 4L layers PCB stackup is the most common options selected by PCB designers. The standard layer stack-up structures can be utilized in most applications.

As a standard option, you can get a variable 4 layer stack up from us, which is defined by following parameters:

  • Prepreg: All the prepreg selection refer S1000HB
  • PCB thickness : 0.5mm/0.8mm/1.0mm/1.6mm/2.0mm/2.5mm/3.0mm
  • Final finished copper thickness : 1/1/1/1oz (Note: the out layer copper thickness is: base copper+plating copper)

4L, T=0.50mm, 1/1/1/1oz

4L PCB Stack-Up T=0.50mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 2116X1 105 Prepreg
INT1 2 Copper 35 Copper
Core FR4 130 Core
INT2 3 Copper 35 Copper
Prepreg 2116X1 105 Prepreg
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 0.5+/-0.10mm

4L, T=0.80mm, 1/1/1/1oz

4L PCB Stack-Up T=0.80mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
INT1 2 Copper 35 Copper
Core FR4 175 Core
INT2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 0.8+/-0.10mm

4L, T=1.00mm, 1/1/1/1oz

4L PCB Stack-Up T=1.00mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
INT1 2 Copper 35 Copper
Core FR4 440 Core
INT2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 1.00+/-0.10mm

4L, T=2.00mm, 1/1/1/1oz

4L PCB Stack-Up T=2.00mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
INT1 2 Copper 35 Copper
Core FR4 1530 Core
INT2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 2.00+/-0.20mm

4L, T=1.60mm, 1/1/1/1oz

4L PCB Stack-Up T=1.60mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
INT1 2 Copper 35 Copper
Core FR4 930 Core
INT2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 1.60+/-0.16mm

4L, T=3.00mm, 1/1/1/1oz

4L PCB Stack-Up T=3.00mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
INT1 2 Copper 35 Copper
Core FR4 2330 Core
INT2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 3.00+/-0.30mm

4L, T=3.00mm, 1/1/1/1oz

4L PCB Stack-Up T=2.50mm

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 18-25 Copper plating
18 Base copper
Prepreg 1080X1 Prepreg
7628X1
INT1 2 Copper 35 Copper
Core FR4 1930 Core
INT2 3 Copper 35 Copper
Prepreg 7628X1 Prepreg
1080X1
BOT 4 Copper 18 Base copper
18-25 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 2.50+/-0.25mm

Above stack-up options is our standard 4L layer PCB buildup that upon the best manufacturing features: such as below for finished thickness 1.60mm with 2/2/2/2 oz 4L PCB stack-up, option 1 is not so good as option 2 (because prepreg 1080 in option 2 has more glue than 7268 in option 1, therefore which can have a better bonding performance with core when it comes to laminate pressing process):

4L, T=1.60mm, 2/2/2/2oz, Option 1

4L PCB Stack-Up T=1.60mm, 2/2/2/2oz, Option-1

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 25-35 Copper plating
35 Base copper
Not the best option Prepreg 7628X1 Prepreg
7628HX1
INT1 2 Copper 70 Copper
Core FR4 460 Core
INT2 3 Copper 70 Copper
Not the best option Prepreg 7628HX1 Prepreg
7628X1
BOT 4 Copper 35 Base copper
25-35 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 1.60+/-0.16mm

4L, T=1.60mm, 2/2/2/2oz, Option 2

4L PCB Stack-Up T=1.60mm, 2/2/2/2oz, Option-2

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 25-35 Copper plating
35 Base copper
The best option Prepreg 1080 (RC 60%) 76 Prepreg
7628 (RC 48%) 220
INT1 2 Copper 70 Copper
Core FR4 830 Core
INT2 3 Copper 70 Copper
The best option Prepreg 7628 (RC 48%) 220 Prepreg
1080 (RC 60%) 76
BOT 4 Copper 35 Base copper
25-35 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 1.60+/-0.16mm

4L, T=1.60mm, 2/2/2/2oz, Option 2

4L PCB Stack-Up T=1.60mm, 2/2/2/2oz, Option-2

Layer T: um Material
SMT Soldermask 20 Solder rmask
TOP 1 Copper 25-35 Copper plating
35 Base copper
The best option Prepreg 1080 (RC 60%) 76 Prepreg
7628 (RC 48%) 220
INT1 2 Copper 70 Copper
Core FR4 830 Core
INT2 3 Copper 70 Copper
The best option Prepreg 7628 (RC 48%) 220 Prepreg
1080 (RC 60%) 76
BOT 4 Copper 35 Base copper
25-35 Copper plating
SMB Soldermask 20 Solder rmask
Finished PCB thickness: 1.60+/-0.16mm

Above stack-up options is our standard 4L layer PCB buildup with 2/2/2/2 oz final finished copper thickness that already upon the best manufacturing features for multi-layer PCBs, they are common and suitable for most PCB design.

If you specifically need a customized multi-layer PCB stack-up or any buildup with impedance control, or you need a specific PCB stack-up with 2oz or upper copper thickness, you can send your request to [email protected]. Our engineer will have a professional response with 2-4 hours.

Shengyi Prepreg S1000HB Reference

Based Material Line Up S1000H (S1000HB)-PREPREG (B-STAGE)

Glass style RC (%) Nominal Thickness Dk Df
mm mil 1GHz 3GHz 5GHz 10GHz 1 GHz 3 GHz 5 GHz 10 GHz
7628 43* 0.185 7.28 4.81 4.74 4.74 4.73 0.014 0.015 0.015 0.016
7628 46 0.195 7.68 4.74 4.68 4.66 4.66 0.015 0.016 0.016 0.016
7628 48 0.205 8.07 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
7628 50 0.215 8.46 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
7628 52 0.225 8.86 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
1506 48 0.160 6.30 4.70 4.63 4.61 4.61 0.015 0.016 0.016 0.017
1506 50 0.170 6.69 4.65 4.58 4.57 4.57 0.016 0.016 0.017 0.017
1506 52 0.180 7.09 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 52* 0.113 4.45 4.59 4.52 4.51 4.50 0.016 0.016 0.017 0.017
2116 53* 0.116 4.57 4.57 4.50 4.49 4.48 0.016 0.017 0.017 0.018
2116 55 0.120 4.72 4.53 4.45 4.43 4.43 0.017 0.017 0.018 0.018
2116 58 0.130 5.12 4.45 4.38 4.36 4.36 0.017 0.018 0.018 0.018
3313 57 0.100 3.94 4.48 4.41 4.39 4.39 0.017 0.018 0.018 0.018
1080 65 0.072 2.83 4.29 4.21 4.19 4.18 0.019 0.019 0.019 0.020
1080 68 0.081 3.19 4.21 4.13 4.11 4.11 0.020 0.019 0.020 0.020
1080 70 0.087 3.43 4.16 4.08 4.05 4.05 0.020 0.019 0.020 0.020
106 73 0.050 1.97 4.09 4.01 3.97 3.97 0.020 0.020 0.020 0.020
106 78 0.063 2.14 3.97 3.89 3.83 3.83 0.02 0.021 0.020 0.022
Remark:
1) Test by SPDR method.
2) The data above show actual values and are not guaranteed, for your reference only.
3) RC* is not common type for reference.
4) Last update: Oct, 2020

Down Load S1000H S1000HB Based Material Line Up References 

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