Xilinx Zynq-7000 XC7Z030-1FBG484C PCB Assembly
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Fab & Assembly Standard
IPC-A-610 Class 3
Inspection Coverage
100% AOI, SPI, X-Ray
Quality System
ISO 9001, AS9100D
Cleanliness
Ionic contamination <1.5 µg/cm² NaCl eq.
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
Aerospace PCB assembly demands zero-defect quality, extreme environmental resilience, and full traceability. Our 20L (20-layer) PCB manufacturing capability enables dense routing, multiple power domains, and controlled impedance for high-speed interfaces. As an electronics manufacturing services provider, we meet these requirements through controlled processes, rigorous inspections, and certified materials.
PCB Layer Count
20L
Material Types
FR4-Tg180
Surface Finish
ENIG (Immersion Gold)
Conformal Coating
AR, SR, Parylene – MIL-I-46058C / IPC-CC-830
Component Types
BGA (0.4mm pitch), QFN, CSP, Passive 01005
Solder Voiding
<5% per BGA ball (3D X-ray verified
Ionic Cleanliness
≤1.5 µg/cm² NaCl eq. (IPC-TM-650 2.3.28)
Thermal Cycling
-55°C to +125°C, 1000 cycles
Design Challenges
High layer count, high-speed signal integrity, thermal management, outgassing
Smallest Saleable Unit
10 pieces (prototype) to 10,000+ pieces (production)
Performance Level
Mission-critical, zero-failure tolerance
20L PCB Thickness
2.4 mm ±10% (typical)
Minimum Trace/Space
4 mil / 4 mil (0.1 mm)
BGA Placement Accuracy
±0.05 mm
Conformal Coating Thickness
25–75 µm (per MIL-I-46058C)
Lead Time (Prototype)
12–18 business days (20L
5–7 weeks
Yes
Component Pull Test
√ for BGA、QFN
ISO 9001:2015, AS9100D (upon request)
Full compliance
Traceability
Component-level lot traceability, solder paste batch ID
Cleanliness Standard
IPC-6012EC, NASA-STD-8739.1
For aerospace and defense applications, every 20L PCB assembly must withstand launch vibration, thermal vacuum, and decades of service. Our electronics manufacturing services for aerospace include:
AOI
X-ray
IPC Class 3
100% functional testing
Discover our high-reliability 20L PCB assembly process for aerospace – from zero-void soldering to zero-flux-residue cleaning and conformal coating.
Aerospace electronics demand the highest level of manufacturing quality. Our 20L aerospace PCB assembly service is designed for mission-critical systems where failure is not an option. We combine:
Our 20L aerospace PCB fabrication and assembly workflow follows strict process controls, from incoming material to final packaging.
Multi-layer lamination, impedance test coupons
Verify date codes, MSL level, ESD protection
Laser-cut stencil, SPI (3D volume measurement)
High-speed pick-and-place with component verification
Nitrogen atmosphere, void control <5%
BGA void detection, solder joint quality
Deionized water spray, conductivity monitoring
Selective spray, UV curing, thickness verification
ICT, flying probe, boundary scan, burn-in
ESD vacuum sealing, vacuum bags or ESD trays
Leveraging our electronics manufacturing services expertise, we deliver aerospace-grade 20L PCB assembly with proven reliability.
A 20-layer PCB provides dedicated signal, power, and ground planes – essential for high-speed digital, RF, and mixed-signal aerospace designs. We support:
Standard reflow can leave voids up to 25%. Our vacuum reflow process reduces voids to <5% – critical for thermal dissipation and mechanical strength in high-power aerospace electronics.
Process: Solder reflow in a vacuum chamber (20–30 kPa) removes trapped gases during solidification.
Residual flux can cause electrochemical migration in humid environments. Our closed-loop deionized water spray system achieves ionic cleanliness ≤1.5 µg/cm² NaCl equivalent – meeting IPC-6012EC and NASA standards.
Verification: Real-time conductivity monitoring + periodic ion chromatography.
Our 20L aerospace PCB fabrication and assembly serves mission-critical systems across the aerospace and defense industry.
Computers
Actuator control
Cockpit displays
Computers
Power distribution
RF communication
Radar/LiDAR
ECM
BMS
Power
Railway
Oil & gas
Controllers
Gimbal control
Control stations
Avionics controllers
Monitoring systems
TVC
A European space prime contractor required a 20L aerospace PCB fabrication, components sourcing, and SMT assembly for a next-generation satellite on-board computer. The board featured a Xilinx Kintex UltraScale FPGA, 20-layer polyimide PCB with blind vias, and 400+ BGA components.
All 50 engineering units passed thermal cycling (-55°C to +125°C) and vibration testing. Full traceability documentation was provided.
IPC class 3 assembly circuit board
For an aerospace project
Explore More of Our High-Quality PCB Product Series
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Core Advantages Material Nickel Silver (C7521), Tin-Plated Steel, or CuFe
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection
Core Advantages Material Aerospace-grade AL6061-T651 Surface Finish Bead-blasted + Anodized