EMI Shielding Cover – Precision EMI/RFI Shields for Electronics Manufacturing
Core Advantages Material Nickel Silver (C7521), Tin-Plated Steel, or CuFe
FPGA Device
Xilinx Zynq-7000 XC7Z030-1FBG484C
Package
FBG484 (17mm × 17mm, 0.8mm pitch)
PCB Stack-up
8-layer PCB with controlled impedance
Assembly Process
Lead-free reflow, IPC-A-610 Class 3
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
The Xilinx Zynq-7000 XC7Z030-1FBG484C integrates ARM Cortex-A9 dual-core processor with Artix-7 FPGA fabric on a single die. As a full-spectrum electronics manufacturing services provider, we specialize in PCB assembly for this high-density BGA device. Our process ensures reliable solder joints, controlled impedance, and functional integrity.
Device Type
FPGA SoC (ARM + FPGA)
Package Style
Fine-Pitch BGA (FBG484)
PCB Layer Count
8-layer PCB (minimum)
Assembly Technology
Lead-free SMT reflow
BGA Ball Count
484 balls
Ball Pitch
0.8 mm
Ball Diameter
0.45 mm
Operating Temperature
-40°C to +100°C (Industrial grade)
Design Challenges
High I/O density, signal integrity, thermal management, firmware validation
Smallest Saleable Unit
5 pieces (prototype) to 10,000+ pieces (mass production)
Performance Level
High-reliability for industrial and automotive applications
BGA Assembly Tolerance
±0.05 mm placement accuracy
Reflow Profile Control
±5°C peak temperature (245-260°C)
Lead Time (Prototype)
7-10 business days (including firmware burning)
Quality System
ISO 9001:2015, IPC-A-610 Class 2/3
X-Ray Inspection
100% for BGA void detection
Firmware Burning
In-house programming with verification
Halogen free
Full compliance
RoHS Status
Full compliance
REACH Status
Full compliance
For high-reliability applications such as industrial motor control, automotive ADAS, and telecom infrastructure, the integrity of Xilinx Zynq-7000 PCB assembly is critical. Our electronics manufacturing services include:
AOI
3D X-ray
ICT test
100% functional testing
Discover our precision assembly processes, quality controls, and the technical expertise behind our IPC Class 3 PCB assembly services.
Explore our complete PCB assembly workflow for Xilinx Zynq-7000 XC7Z030-1FBG484C – from 8-layer PCB fabrication to impedance control and firmware burning.
We follow a tightly controlled production process – from PCB fabrication to firmware burning – to ensure reliable PCB assembly for Xilinx Zynq-7000 devices.
Core material (e.g., IT-180A, TU-872) with impedance test coupons
Laser-cut stencil, SPI for volume/alignment check
High-speed placement of FBG484 package (±0.05mm accuracy)
Lead-free profile, nitrogen atmosphere, void control
BGA void detection, component alignmen
Programming of bootloader, FPGA bitstream, and application code
Power-on, clock validation, I/O loopback, JTAG boundary scan
Packaging with EVA foam insert and crash lock box
Leveraging our electronics manufacturing services expertise, we deliver Xilinx Zynq-7000 PCB assembly with proven quality and traceability.
An 8-layer PCB provides dedicated power and ground planes, reducing noise coupling. We implement impedance control on critical nets:
The 0.8mm pitch FBG484 package requires:
Firmware burning-in is performed after assembly but before final test. We support (Each device is verified with checksum and read-back test.):
The Xilinx Zynq-7000 XC7Z030-1FBG484C is widely used in applications requiring both real-time processing and programmable logic. Our electronics manufacturing services support the following segments:
PLC/PAC controllers – Custom motion control algorithms in FPGA fabric
Machine vision systems – High-speed image preprocessing
Robotics – Real-time sensor fusion and motor control
PLC
vision systems
Robotics
ADAS controllers – Camera input processing, sensor fusion
In-vehicle infotainment – Graphics acceleration, multi-display output
Telematics gateways – Secure communication, data logging
Controllers
Vehicle
Gateways
Small cell base stations – PHY layer processing, packet routing
Software-defined radio (SDR) – Modem algorithms, signal processing
Network appliances – Firewall, deep packet inspection
Base stations
SDR
Network
Ultrasound systems – Beamforming, image reconstruction
Patient monitors – Multi-parameter data acquisition application
Portable diagnostic tools – Low-power processing on FPG
Monitors
Ultrasound
Diagnostic tools
Avionics
Radar
Secure
Autonomous navigation – Real-time sensor fusion from LiDAR, cameras, and IMU
Flight controllers for drones – High-bandwidth motor control and attitude stabilization
Industrial robotic arms – Precision motion planning and vision-guided pick-and-place
Drones
Industrial robotic
Autonomous navigation
A European industrial automation customer needed a custom PCB assembly for their next-generation PLC controller. The design used a Xilinx Zynq-7000 XC7Z030-1FBG484C, requiring an 8-layer PCB with impedance control on 32 differential pairs. Our electronics manufacturing services delivered:
All 3000 units passed functional testing and were delivered in 4 weeks – 2 weeks ahead of schedule.
Deionized water cleaning
On a IPC class 3 assembly circuit board
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