Xilinx Zynq-7000 XC7Z030-1FBG484C PCB Assembly
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Material
Nickel Silver (C7521), Tin-Plated Steel, or CuFe Alloy
Surface Finish
Tin Plating / Nickel Plating / Silver Plating
Flammability Rating
V-0 (for coated versions)
Application
RF Modules, Wireless
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
CNC-pressed or photo-etched EMI shielding covers provide exceptional attenuation (up to 80 dB at 1 GHz) while maintaining mechanical integrity. Ideal for noise-sensitive applications including wireless transceivers, automotive ECUs, and industrial control systems. Our electronics manufacturing services integrate shielding production directly with PCB assembly to ensure perfect fit and reduced lead times.
Material Options
Nickel Silver, Cold-Rolled Steel, Copper Alloy, Stainless Steel
Manufacturing Process
Precision Die Cutting / Photo Etching / CNC Press Brake
Surface Treatment
Tin, Nickel, Silver, or Solder-Coated (Lead-free)
Shielding Effectiveness
60–80 dB (30 MHz – 6 GHz)
Material Thickness
0.10 mm – 0.50 mm
Flatness
≤ 0.05 mm
Density
8.9 g/cm³ (for Nickel Silver)
Design Challenges
Smallest Saleable Unit
Component Placement
10 pieces (prototype) to 100,000+ pieces (mass production)
Performance Level
Excellent attenuation, solderability, and corrosion resistance
Manufacturing Tolerance
±0.05 mm (standard), ±0.02 mm (precision)
Max Part Size
300 mm × 300 mm (larger on request)
Lead Time (Prototype)
5–7 business days
Operating Temperature
-40°C to +125°C (Tin-plated version)
Solder Reflow Compatibility
Lead-free reflow up to 260°C peak
Corrosion Resistance
96 hours salt spray (for plated surfaces)
Material Certification
RoHS, REACH, Conflict Mineral Compliant
Surface Finish Standard
ASTM B545 (Tin), ASTM B689 (Nickel)
Quality System
ISO 9001:2015, IATF 16949 (automotive), IPC-A-610 for assembled PCBs
In high-reliability applications like wireless infrastructure, automotive telematics, and medical telemetry, the integrity of an EMI shielding cover is critical to system performance and regulatory compliance. Our shielding covers are manufactured under strict quality controls, ensuring each unit meets rigorous attenuation and mechanical standards. Every cover undergoes dimensional inspection, flatness testing, and solderability verification to guarantee performance under continuous thermal cycling and vibration.
Wirless
Antenna
RF
Medical telemetry
Discover our precision assembly processes, quality controls, and the technical expertise behind our IPC Class 3 PCB assembly services.
Discover our material selection, process workflow, and quality control for precision EMI shielding covers – designed to integrate seamlessly with normal PCB assembly flow.
We use a tightly controlled process – from material inspection to final testing – to ensure stable, reliable shielding quality, especially when paired with PCB assembly workflows.
Incoming coils or sheets verified for thickness, flatness, and coating.
CAD-driven toolpath generation for etching or stamping d
Photo etching (burr-free) or CNC press brake (for bent designs).
Tin, nickel, or silver plating to enhance solderability and corrosion resistance.
Vision system checks dimensions, flatness, and edge condition.
Tapes or trays compatible with SMT lines.
Ultrasonic cleaning (if required) and anti-static bag
Inspection report, material cert, and CoC included
Leveraging stringent material selection and scientifically engineered processes – from raw coil to finished shield – our EMI covers deliver superior attenuation and mechanical consistency for even the most sensitive RF designs.
Photo etching achieves ±0.02 mm tolerances with no burrs or stress, ensuring consistent placement during high-speed PCB assembly. The cover sits flush against ground pads without rocking.
Material thickness, alloy composition, and vent pattern are engineered for maximum shielding effectiveness across specific frequency bands – from AM/FM to 5G sub-6 GHz.
Every cover is designed for automated pick-and-place. Flatness and edge geometry are controlled to prevent nozzle pickup failures, and optional solder tabs enable reflow attachment alongside other SMT components.
We utilize advanced manufacturing processes to ensure every EMI shielding cover meets industrial-grade standards – ideal for use in your electronics manufacturing services supply chain.
Wi-Fi, Bluetooth, LoRa, Zigbee, and cellular (4G/5G) modules requiring isolation from adjacent noise sources.
Wi-Fi
Bluetooh
LoRa
ECUs, ADAS controllers, telematics units, and infotainment systems demanding reliable shielding under thermal cycling and vibration.
ECUs
ADAS controllers
Telematics units
Patient monitors, portable ultrasound, and implantable device programmers requiring EMC compliance (IEC 60601-1-2).
Patient monitors
Portable ultrasound
Implantable device
PLC I/O modules, motor drives, and fieldbus couplers where electromagnetic noise can corrupt data.
PLC
Motor drives
Fieldbus couplers
Smart speakers, gaming consoles, and tablets – especially compact devices with dense component placement.
Speakers
Gaming console
Gaming tablets
Base station filters, small cell radios, and optical transport gear needing stable attenuation over temperature.
Base station
Small cell radios
Optical transport gear
A European automotive Tier 1 supplier needed to reduce EMI crosstalk in a next-generation ADAS ECU. Our nickel-silver shielding covers, placed directly over the processor and DDR memory during PCB assembly, achieved 75 dB attenuation at 2.4 GHz. The covers passed 1,000 thermal cycles (-40°C to +125°C) and were delivered in tape-and-reel packaging for their SMT line – all within 6 weeks.
Nickel-silver shielding covers
Placed directly over the processor and DDR memory
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