Xilinx Zynq-7000 XC7Z030-1FBG484C PCB Assembly
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
High-speed Laminate
TUC TU-933+
High layers
36L
Large size
1041.00mmX621.00mm
Quality Standards
IPC 6012D & IPC 600J CLASS 3
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
This is a 36-layer high-speed backplane PCB manufactured with TUC TU-933+ laminate: Dk 3.08, Df 0.0020 @ 10GHz, Tg 220°C . Features 3 mil trace/space, backdrilling (stub <3 mil), ENIG finish, and ±5% impedance control for 25G/56G PAM4 signaling . Ideal for data center switches, core routers, and 5G infrastructure .
Layers
36L
Tg (TMA)
170 °C
Surface finishing
ENIG: IPC-4552
Core
TU-933+
Prepreg
TU-933P+
Thickness
6.5+/-6% mm
Out layer copper
1/3 oz
Inner layer copper
2 oz
Aspect ratio
18.5:1
Back drill
Multiple back-drill
Differential impedance
110 +/-8% ohm
Single end impedance:
50 +/- 5% ohm
Dielectric Constant
( Dk )
3.08 @ 10GHz
Dissipation Factor
( Df )
0.0020 @ 10GHz
Surface Resistivity
MΩ
> 108
Cosmetic checking
IPC 6012D & IPC 600J CLASS 3
RoHS Status
Yes
REACH Status
Yes
This 36-layer communication backplane PCB undergoes rigorous DFM verification though powerful CAM software Genesis 2000, and impedance simulating tooling Polar Si900e, ensuring optimal manufacturability with ThunderClad 3+ super low loss laminate and prepreg. Combined with 100% electrical testing, AOI, microsection analysis, and impedance validation per IPC Class 3 standards, we guarantee zero defects for mission-critical data center and telecom infrastructure applications.
RoHS
UL
REACH
IPC 6012D & IPC 600J CLASS 3
Discover the technical features, manufacturing processes, and performance advantages of our data communication application PCB products.
Developed by experienced engineers, our High-Performance Heterogeneous Computing Server PCBs integrate advanced technical features and precision manufacturing processes. Every design undergoes rigorous DFM verification using Genesis 2000 and impedance simulation with Polar 9000, ensuring signal integrity and reliability. The result: enabling high-speed data transmission across specific devices
We use our self-developed, customized production process, strictly controlling every step from raw material inspection to finished product inspection and testing to ensure stable and reliable printed circuit board quality.
Senior engineers perform DFM checks using Genesis 2000 and Polar Si9000e.
High-quality base material and copper foil selection, meantime optimization and compensation of production data
Photolithography, etching, and AOI inspection
Strictly follow the layer stackup structure confirmed by the customer.
Precision drilling, strictly controlling hole wall roughness to ensure sufficient plating.
Photolithography, etching, plating and AOI inspection
No subcontracting; all processes are performed in-house and comply with IPC-4552.
High-precision CNC routing and 100% electrical testing, differential pairs impedance and single end impedance testing.
Rigorous DFM analysis, premium material selection, and scientifically controlled processes ensure our PCBs deliver exceptional electrical performance and mechanical stability, excelling in the most demanding applications.
Excellent High-speed Laminate TUC TU-933+ material suport: Low dielectric loss, high insulation resistance, and stable electrical parameters ensure signal transmission integrity and reliability
Rigorous reliability testing—including thermal shock, humidity, vibration, and both differential and single-ended impedance verification—ensures long-term operational stability under the most demanding conditions.
Backed by a team of expert engineers and skilled technicians, our cutting-edge production equipment and strict quality systems deliver PCBs that consistently meet and exceed high-standard requirements.
We utilize advanced manufacturing processes to ensure that every PCB circuit board meets industrial-grade standards.
High-speed backplanes for core switches and routers handling 25G/56G PAM4 signals, featuring ultra-low-loss materials (Megtron 6/ThunderClad 3+) and ±5% impedance control for multi-terabit throughput.
Core switches
ultra-low-loss
Multi-terabit throughput.
Backplane PCBs for base stations (BBU/AAU) and fronthaul/backhaul equipment, supporting massive MIMO and millimeter-wave frequencies with Df <0.005 signal integrity.
BBU/AAU)
Massive MIMO and millimeter-wave
signal integrity.
36-layer backplanes for service provider and enterprise core routing platforms requiring 50+ Gbps per lane performance with backdrilled vias (<3 mil stub) to eliminate signal reflections.
core routing
Support 50+ Gbps
Eliminating signal reflections
High-density backplanes for OTN/WDM equipment enabling 400G/800G optical transmission with hybrid material construction combining high-frequency laminates and FR-4 cores.
Support 400G/800G
Hybrid material construction
High-frequency laminates
Backplane interconnects for HPC clusters and AI servers requiring low latency and high bandwidth with precision differential pair routing (100Ω ±5%) and TDR-verified performance.
low latency
HPC clusters
AI servers
Ruggedized backplane systems for radar, avionics, and secure communications, meeting IPC Class 3 standards with extended temperature range and vibration-resistant construction.
Radar
Avionics
Secure communications
A leading networking equipment manufacturer required a 36-layer high-speed backplane PCB for next-generation core routers using ThunderClad 3+ ultra-low-loss laminate. Our engineering team performed rigorous DFM analysis and impedance simulations, achieving ±5% control across all 100Ω differential pairs. Post-production TDR testing confirmed signal integrity at 56G PAM4, enabling seamless deployment in hyperscale data center applications.
Backplane High-Speed Systems
Line card ↔ switch fabric connectivity
Explore More of Our High-Quality PCB Product Series
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Core Advantages Material Nickel Silver (C7521), Tin-Plated Steel, or CuFe
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection