Xilinx Zynq-7000 XC7Z030-1FBG484C PCB Assembly
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Raspberry Pi Compute Module
CM4108032
Enclosure Material
AL 6061
Edge Computing Applications
8GB RAM, 32GB eMMC
Application
Intelligent loT for Hospital
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
This Custom Raspberry Pi box building assembly featuring Raspberry Pi Compute Module CM4108032 housed in precision-machined AL 6061 aluminum enclosure. Provides superior thermal management, EMI shielding, and mechanical protection for industrial IoT and edge computing applications. Ideal for harsh environments requiring reliable 24/7 operation.
Core PCBA board
CM4108032
Support PCBA board
8 layer, rigid PCB
Enclosure box
AL 6061, clear color
Processor
Quad-core Cortex-A72 @ 1.5GHz
Memory
8GB @ 3200MHz
Storage
32GB onboard
Processor
Broadcom BCM271
Memory
8GB LPDDR4 RAM
Storage
32GB eMMC Flash
Signal Integrity
1.5GHz CPU clock
Thermal Management
85°C maximum operating temperature
Power Integrity
Clean 5V supply
Power rail voltage
5V ±3%, 3.3V ±3%, 1.8V ±3%
Signal integrity
Eye diagram pass at 1.5GHz
USB differential impedance
90Ω ±15%
PCB Fabrication
IPC-6012 Class 3
Assembly
IPC-A-610 Class 3
Soldering
J-STD-001 Class 3
Every CM4108032-based system undergoes rigorous PCB fabrication (IPC-6012 Class 3), precision CNC AL 6061 enclosure assembly, and comprehensive electrical testing. Validated through thermal cycling, vibration, and functional verification—guaranteeing reliable 24/7 operation in demanding industrial environments.
RoHS
UL
REACH
Ionic contamination test
Discover our process workflow from PCB fabrication, assembly, CNC machining, box building assembly, final testing, and quality control for Custom Raspberry Pi integrated product.
The CM4108032 industrial computing system integrates a precision-designed carrier board, robust AL 6061 CNC-machined enclosure, and comprehensive assembly services—delivering reliable 24/7 performance for demanding IoT, edge computing, and mission-critical applications.
Our custom Raspberry Pi box building assembly follows a meticulously controlled production workflow—from incoming component inspection (carrier boards, CM4108032 modules, AL 6061 enclosures) through precision assembly, thermal interface application, and final software-loading. Each unit undergoes comprehensive functional testing to ensure reliable 24/7 operation in demanding industrial environments.
100% verification of all components: CM4108032 modules, carrier boards, AL 6061 enclosures, Hirose connectors, and mounting hardware against specifications.
Precision SMT assembly with automated pick-and-place, stencil printing, and reflow soldering per IPC-A-610 Class 3 standards.
eMMC firmware burning-in using rpiboot tool with validated OS images (Raspberry Pi OS, Ubuntu, or custom Yocto builds) before module installation.
Careful Hirose connector alignment and seating of CM4108032 onto carrier board with controlled uniform pressure.
Precision-machined AL 6061 housing with bead-blasted anodized finish, including M2.5 standoff installation and connector cutout verification.
Board mounting into enclosure with thermal interface material application (where required), connector alignment, and secure lid fastening.
Comprehensive validation including power-on self-test, memory/storage verification, interface functionality (USB, Ethernet, GPIO), and wireless performance.
Final inspection per IPC standards, thermal imaging under load, and packaging with individual serialization for traceability.
Leveraging precision component sourcing and scientifically engineered processes—from custom carrier board fabrication and CM4108032 integration to CNC-machined AL 6061 enclosure assembly—our custom Raspberry Pi systems deliver reliable computing performance and mechanical robustness for even the most demanding industrial IoT and edge computing applications.
Precision-designed carrier boards with controlled impedance (90Ω differential pairs, 100Ω Ethernet, 50Ω RF) ensure stable 1.5GHz processor performance and reliable high-speed data transmission.
AL 6061 aluminum enclosure with optimized mechanical interface provides exceptional passive cooling, maintaining junction temperatures below 85°C under sustained full load without active fans.
Precision-machined aerospace-grade enclosure delivers EMI shielding, vibration dampening (tested to 6Grms), and environmental sealing—ensuring 24/7 reliability in harsh industrial environments.
Leveraging advanced manufacturing processes and stringent quality control, our custom Raspberry Pi box building assembly delivers industrial-grade reliability across a wide spectrum of demanding applications—ensuring stable 24/7 operation in mission-critical environments.
Data aggregation and edge processing from sensors, PLCs, and machinery in smart factories, with robust AL 6061 enclosure protecting against dust, vibration, and temperature extremes.
Robust AL 6061
Against dust
Against vibration
Real-time analytics and AI inference at the network edge for autonomous systems, leveraging 8GB RAM and 1.5GHz processing power in a compact, passively cooled form factor.
AI inference
8GB RAM
1.5GHz processing power
High-reliability media players for retail, transportation hubs, and public spaces, featuring custom enclosures with integrated mounting and thermal management.
High-reliability
Integrated mounting
Thermal management
In-vehicle data logging, fleet management, and entertainment systems, with vibration-dampened enclosures and extended temperature range operation.
Data logging
Fleet management
Entertainment systems
Embedded control systems for diagnostic equipment, patient monitors, and laboratory instruments, meeting stringent reliability and longevity requirements.
Diagnostic equipment
Patient monitors
Laboratory instruments
Remote sensor nodes for soil, weather, and crop monitoring in harsh outdoor environments, benefiting from sealed enclosures and low-power optimization.
Soil
Weather
Crop monitoring
A European smart medical company required rugged edge computing nodes for remote field monitoring on hospital. Our custom CM4108032 system with AL 6061 CNC-machined enclosure eliminated connectivity failures, ensuring reliable 24/7 data collection under extreme temperatures, dust, and moisture.
Smart CM4108032 system
For remote field monitoring
Explore More of Our High-Quality PCB Product Series
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Core Advantages Material Nickel Silver (C7521), Tin-Plated Steel, or CuFe
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection