Xilinx Zynq-7000 XC7Z030-1FBG484C PCB Assembly
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Potting Material
3M-DP270
Enclosure Material
POM plastic
Flammability Rating
UL94 HB
Application
Energy Storage Industry
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
3M™ DP270 epoxy potting compound delivers exceptional protection for ECU PCBs in demanding environments. Ideal for applications requiring high reliability, including general industrial electronics, military and government systems, specialty vehicles, transportation infrastructure, and consumer goods. Its low-viscosity formulation ensures complete encapsulation, safeguarding against vibration, moisture, and thermal shock.
Adhesive Type
Epoxy
Bond Flexibility
Rigid
Color
Clear or Black
Full Cure Time
48 hr
Hardness
83 Shore D
Open Time
60 min @ 72 °F (22 °C
Design Challenges
Noise Vibration & Harshness Control NVH
Smallest Saleable Unit
Pack
Performance Level
Good
Storage Temperature (Celsius)
22 °C
Storage Temperature (Fahrenheit)
72 Degree Fahrenheit
Work Life
60 min
Dielectric Constant
(ASTM D-150)
3.5 @ 1 KHz @ 23°C (73°F)
Dielectric Strength
(ASTM D-149)
850 volts/mil
Insulation Resistance
(.8 mm/.8 mm comb
pattern on FR-4)
Flammability Rating
UL 94 HB
RoHS Status
Not applicable
REACH Status
REACH Unaffected
In the rapidly evolving landscape of heavy-duty vocational truck electrification, the reliability of electronic control unit (ECU) PCBA assemblies is paramount. The 3M™ DP270 epoxy potting compound delivers uncompromising quality assurance for these mission-critical applications, ensuring long-term performance under extreme operating conditions.
RoHS
UL
Low Viscosity
Non-Corrosive to Copper
Discover our material selection, process workflow, and quality control for encapsulated electronic products.
For demanding industrial control applications, this battery pack encapsulant combines a durable POM housing with high-performance 3M™ DP270 epoxy. The system provides superior electrical insulation, vibration dampening, and long-term environmental protection—ensuring reliable operation in harsh conditions.
We use our self-developed, customized production process, strictly controlling every step from raw material inspection to finished product testing to ensure stable and reliable product quality.
Precision-molded POM enclosures are cleaned and inspected for dimensional accuracy and surface integrity.
After the PCB is fabricated, assembled, and has passed all foundational tests, it is securely positioned inside the housing, ensuring proper alignment for encapsulation.
Assembled units are pre-baked in a controlled oven to remove any residual moisture before epoxy application.
The two-part epoxy is precisely mixed at a recommended ratio to ensure optimal curing and performance.
The mixed epoxy is dispensed under vacuum to eliminate air bubbles and achieve void-free protection.
Filled units are cured at a specified temperature profile to maximize adhesion and dielectric strength.
Cured assemblies are inspected for surface defects, epoxy coverage, and housing integrity.
Final products undergo insulation resistance, high-voltage, and thermal shock tests to validate performance.
Leveraging stringent material selection and scientifically engineered processes—from PCB fabrication and SMT assembly to final encapsulation—our electronic devices deliver superior electrical performance and mechanical stability for even the most demanding applications.
The 3M™ DP270 epoxy encapsulant provides excellent electrical isolation, preventing short circuits and ensuring safe operation in high-voltage industrial environments.
The combination of a sealed POM housing and void-free epoxy encapsulation offers robust protection against moisture, dust, chemicals, and thermal shock.
The encapsulating material absorbs mechanical stress and dampens vibrations, safeguarding sensitive components and solder joints from fatigue and failure.
We utilize advanced manufacturing processes to ensure that every PCB circuit board meets industrial-grade standards.
Encapsulated PCBs withstand dust, oil, and vibration in factory environments, ensuring long-term reliability for PLCs, motor drives, and robotic controllers.
Dust-resistant
Oil-proof
Vibration-damping
Provides high dielectric strength and thermal stability for battery monitoring circuits, protecting against moisture, electrolyte exposure, and mechanical shock.
High-voltage
Thermal-stable
Shock-resistant
Protects power conversion and monitoring electronics from extreme weather, UV exposure, and temperature cycling in outdoor installations and operations.
Weatherproof
UV-resistant
Wide-temperatur
Ensures fail-safe operation of signaling, tracking, and control electronics under continuous vibration, wide temperature ranges, and airborne contaminants.
Vibration-proof
Wide-range
Contaminant-sealed
Delivers biocompatible, chemical-resistant protection for sensitive control printed circuit boards used in diagnostic devices and sterilizable instruments.
Biocompatible
Chemical-resistant
Sterilizabl
Seals environmental sensors and communication modules against rain, snow, humidity, and pests, enabling maintenance-free operation in remote locations.
Hermetic
Humidity-proof
Maintenance-free
A Canadian industrial automation leader needed a rugged encapsulation solution for motor drives deployed in harsh outdoor factories. Our POM-housed system with 3M™ DP270 epoxy eliminated field failures, ensuring reliable 24/7 operation under extreme dust, vibration, and humidity.
Heavy-duty vocational trucks
Encapsulated power-pack solutions
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Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Core Advantages Material Nickel Silver (C7521), Tin-Plated Steel, or CuFe
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection