Xilinx Zynq-7000 XC7Z030-1FBG484C PCB Assembly
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
High-speed Laminate
Panasonic Megtron 6
High layers
16L
Mixed Impedances
Differential tolerance: +/-8%
Quality Standards
IPC 6012D & IPC 600J CLASS 3
Consulting
+86 755 2828 2776
Business Hours (Mon.-Sat.)
9:00 - 18:00
This is a 16L High-frequency multi-layer PCB manufactured with Panasonic Megtron 6: low Dk/Df, ultra-low signal loss, mixed impedance control (±5% for single and ±8% for differentiate), 1/3 oz in out-layer–2oz copper inner layer, halogen free+RoHS compliant. Ideal for 5G, radar, and high-speed digital applications.
Layers
16L
Tg
185 (DSC)
Surface finishing
ENIG: IPC-4552
Core
R-5785(GN)
Prepreg
R-5670
Thickness
3.2+/-0.32 mm
Out layer copper
1/3 oz
Inner layer copper
2 oz
Aspect ratio
19:1
Back drill
10 Different back drill depth
Differential impedance
120 +/-8% ohm
Single impedance:
50 +/- 5% ohm
Dielectric Constant
( Dk )
3.71 @ 1GHz
3.61 @ 10GHz
Dissipation Factor
( Df )
0.002@ 1GHz
0.004@ 10GHz
Surface Resistivity
MΩ
1 x 108
Cosmetic checking
IPC 6012D & IPC 600J CLASS 3
RoHS Status
Yes
REACH Status
Yes
Prior to production, every multilayer PCB design undergoes rigorous DFM verification using Genesis 2000, detecting potential manufacturing issues early. Combined with 100% electrical testing, AOI, and microsection analysis per IPC Class 3 standards, we guarantee zero defects for mission-critical aerospace, medical, and automotive applications.
RoHS
UL
REACH
IPC 6012D & IPC 600J CLASS 3
Discover the technical features, manufacturing processes, and performance advantages of our muti-layer PCB products.
Developed by experienced engineers, our High-Performance Heterogeneous Computing Server PCBs integrate advanced technical features and precision manufacturing processes. Every design undergoes rigorous DFM verification using Genesis 2000 and impedance simulation with Polar 9000, ensuring signal integrity and reliability. The result: superior performance advantages for demanding data center and AI workloads.
We use our self-developed, customized production process, strictly controlling every step from raw material inspection to finished product inspection and testing to ensure stable and reliable printed circuit board quality.
Senior engineers perform DFM checks using Genesis 2000 and Polar Si9000e.
High-quality base material and copper foil selection, meantime optimization and compensation of production data
Photolithography, etching, and AOI inspection
Strictly follow the layer stackup structure confirmed by the customer.
Precision drilling, strictly controlling hole wall roughness to ensure sufficient plating.
Photolithography, etching, plating and AOI inspection
No subcontracting; all processes are performed in-house and comply with IPC-4552.
High-precision CNC routing and 100% electrical testing, differential pairs impedance and single end impedance testing.
Rigorous DFM analysis, premium material selection, and scientifically controlled processes ensure our PCBs deliver exceptional electrical performance and mechanical stability, excelling in the most demanding applications.
Excellent Megtron 6 material suport: Low dielectric loss, high insulation resistance, and stable electrical parameters ensure signal transmission integrity and reliability
Rigorous reliability testing—including thermal shock, humidity, vibration, and both differential and single-ended impedance verification—ensures long-term operational stability under the most demanding conditions.
Backed by a team of expert engineers and skilled technicians, our cutting-edge production equipment and strict quality systems deliver PCBs that consistently meet and exceed high-standard requirements.
Leveraging advanced manufacturing processes and stringent quality control, our 16-layer Panasonic Megtron 6 high-speed PCBs deliver ultra-low signal loss (Df 0.002-0.004 @ 10GHz) and stable dielectric performance (Dk 3.4-3.7) across mission-critical applications—ensuring reliable data transmission up to 25 Gbps and beyond.
High-frequency PCBs for 5G base stations (AAU/RRU), millimeter-wave antennas, and RF front-ends requiring low insertion loss and stable Dk at mmWave frequencies.
low insertion loss
stable Dk
mmWave frequencies
16-layer server motherboards and 400G/800G optical module PCBs supporting PCIe 5.0/6.0 and 56G PAM4 signaling with ±8% differential impedance control.
High-voltage
Thermal-stable
Shock-resistant
77GHz/79GHz millimeter-wave radar PCBs for advanced driver-assistance systems, featuring exceptional CAF resistance and thermal reliability for harsh automotive environments.
millimeter-wave radar
CAF resistance
Thermal reliability
High-reliability circuit boards for satellite communication, avionics, and radar systems requiring extended temperature range (-55°C to +125°C) and military-grade durability.
Satellite communication
Avionics
Radar systems
GPU accelerator cards and AI server motherboards with 16-layer Megtron 6 construction, enabling high-speed interconnects for NVIDIA/AMD computing platforms.
GPU accelerator
High-speed interconnects
Sterilizabl
Core routers, high-speed switches, and OTN transport equipment requiring ultra-low loss materials for long backplane channels and 100G/400G Ethernet applications.
Routers
High-speed switches
OTN transport
A client in the aerospace sector designed two sister boards with similar circuit architectures. However, due to the involvement of different engineers during fabrication, significant discrepancies in signal feedback were observed during on-site application. Upon investigation, our engineering team identified that the root cause was inconsistent stackup configurations between the two designs. After redesigning both boards with identical stackups and refabricating them, the signal feedback showed no significant differences between the two sister boards.
Networking, and wireless applications
Requiring high-speed, ultra-low loss circuit materials.
Explore More of Our High-Quality PCB Product Series
Core Advantages FPGA Device Xilinx Zynq-7000 XC7Z030-1FBG484C Package FBG484 (17mm
Core Advantages Material Nickel Silver (C7521), Tin-Plated Steel, or CuFe
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection
Core Advantages Fab & Assembly Standard IPC-A-610 Class 3 Inspection