Table of Contents

CTI in PCB Materials: Beyond FR-4 Selection

PCB material stackup illustration for CTI and electrical reliability
In PCB design and manufacturing, engineers usually focus on impedance control, thermal performance, stackup structure, and signal integrity. However, the base material itself determines another critical reliability factor: Comparative Tracking Index (CTI).
For high-voltage, automotive, industrial, and safety-critical PCB applications, CTI affects electrical reliability, creepage distance requirements, and certification compliance. This guide explains CTI ratings, IEC 60112 testing, material selection, and practical PCB design considerations.

CTI Material Selection Reference

The correct CTI level depends on voltage, pollution environment, and safety requirements. The table below provides a practical starting point for PCB material selection.
ApplicationRecommended CTITypical Material Group
Consumer electronics in controlled environments175–250VGroup IIIA
Industrial control equipment≥400VGroup II
Automotive electronics and under-hood systems≥600VGroup I
EV power electronics and harsh environments≥600VGroup I
PCB Material Selection Consideration

Do not select PCB laminate only by the term “FR-4”. FR-4 identifies a flame-retardant material classification, not a specific CTI performance level. Different FR-4 laminate grades can have significantly different tracking resistance, thermal properties, and electrical characteristics.

Need Engineering Support for PCB Material Selection?

Weller PCB engineers can help evaluate laminate selection based on CTI requirements, working voltage, creepage distance, thermal performance, signal integrity, and manufacturing requirements.

Contact Weller PCB →

1. What Is CTI in PCB Materials?

Comparative Tracking Index (CTI) is the maximum voltage that an insulating material can withstand during a standardized contamination test without forming a conductive tracking path on its surface.
In practical PCB applications, CTI measures how well a substrate resists surface leakage current caused by:
PCB surface tracking failure caused by moisture contamination and leakage current

How Electrical Tracking Happens

  1. Contamination accumulates: Dust, moisture, or residues collect on the PCB surface.
  2. Surface conductivity increases: Moisture creates a temporary leakage path between conductors.
  3. Current generates heat: Local heating damages the resin system.
  4. Carbonized tracking forms: A permanent conductive path develops, increasing failure risk.
Critical Engineering Difference

CTI evaluates resistance against surface tracking. It is different from dielectric breakdown, which occurs through the insulation material. High-voltage PCB designs must evaluate both insulation strength and tracking resistance.

2. CTI vs PTI: What Is the Difference?

CTI and PTI are both defined by IEC 60112, but they serve different purposes.
PropertyCTIPTI
PurposeDetermines the tracking resistance capability of a materialVerifies performance at a defined voltage level
Test MethodVoltage is varied to determine tracking resistance limitFixed voltage test with pass/fail evaluation
ResultNumerical value such as CTI 600VPass or fail result
Engineering UsageMaterial selection and PCB design comparisonCompliance verification
Practical PCB Design Note

PCB laminate datasheets usually provide CTI values because they allow engineers to compare different materials. Final product compliance should always be verified according to the applicable safety standard.

3. How Is CTI Measured? The IEC 60112 Test Method

IEC 60112 defines the standardized test method used to determine Comparative Tracking Index values for solid insulating materials. The test evaluates material resistance against tracking under controlled contamination and electrical stress.

CTI Test Principle

  • Electrodes: Conductive electrodes are placed on the material surface with defined spacing.
  • Contamination: A standardized electrolyte solution is repeatedly applied between the electrodes.
  • Voltage Stress: The applied voltage is increased to evaluate tracking resistance.
  • Result: The highest voltage without tracking failure becomes the CTI value.
The IEC 60112 method provides a repeatable way to compare insulating materials. However, actual PCB reliability depends on the complete insulation design, including voltage level, environment, spacing, and protection methods.
Engineering Consideration

CTI should not be evaluated alone. PCB designers must also consider working voltage, pollution degree, creepage distance, clearance distance, and the applicable safety standard.

Test Flow Diagram

Prepare specimen → Place electrodes (4mm gap) → Apply voltage →
Drip contaminant (every 30s) → Monitor current →
Withstands 50 drops? → YES → Increase voltage, retest →
Tracking failure? → Decrease voltage, retest →
Find highest voltage with 5/5 pass → CTI = that voltage

4. CTI Grades and IEC Material Groups

Based on the CTI test result, materials are classified into Performance Level Categories (PLC) and corresponding IEC Material Groups. These classifications are referenced throughout safety standards and design rules:
Material GroupCTI RangeTypical Applications
Group ICTI ≥600VAutomotive electronics, EV systems, industrial power equipment
Group II400V ≤ CTI <600VIndustrial controls and high-reliability electronics
Group IIIA175V ≤ CTI <400VGeneral FR-4 PCB applications
Group IIIB100V ≤ CTI <175VLow-cost applications with limited electrical stress
Material Selection Tip

A higher CTI rating does not automatically replace other PCB requirements. Engineers should also evaluate Tg, Dk/Df, thermal performance, assembly requirements, and manufacturing capability.

5. How CTI Affects Creepage Distance

CTI relationship with PCB creepage distance and clearance distance
Creepage distance is the shortest path between two conductive parts measured along the surface of an insulating material. In high-voltage PCB designs, CTI affects the material group used for insulation coordination calculations.
According to IEC 60664-1, creepage requirements depend mainly on:
  • Working voltage (RMS or DC)
  • Pollution degree (1 = clean/dry, 2 = occasional condensation, 3 = conductive pollution, 4 = persistent conductive pollution)
  • Material CTI group (I, II, IIIA, IIIB)
ParameterEngineering Meaning
CTIResistance of the material surface against electrical tracking
Creepage DistanceRequired surface distance between conductive parts
Clearance DistanceAir distance required to prevent electrical breakdown
Higher CTI materials can reduce tracking risk and may allow shorter creepage distances under the same operating conditions. However, CTI does not replace clearance requirements.
For high-speed PCB layouts, insulation design must also consider stackup structure and signal integrity. See our guide on stripline vs microstrip for additional PCB layout considerations.

6. CTI Requirements by PCB Application

Different PCB applications have different CTI requirements because the risk of tracking depends on voltage level, environmental exposure, and product safety requirements.

ApplicationMain Risk FactorsRecommended CTI Range
Automotive ElectronicsHumidity, temperature cycling, contamination, vibration≥400V–600V
Industrial Control SystemsHigh voltage, dust, factory environments≥400V
Outdoor TelecommunicationsMoisture and environmental exposure≥600V
Medical EquipmentSafety-critical insulation requirementsBased on applicable standards
Consumer ElectronicsControlled indoor environments175V–300V

For automotive controllers, EV systems, and industrial power electronics, higher CTI materials are often preferred because tracking failures can create safety risks, unexpected downtime, and expensive field repairs.

Reliability requirements should also be evaluated according to manufacturing quality standards such as IPC Class 2 vs Class 3, especially for products requiring long operating life and higher failure prevention requirements.

7. Common PCB Material CTI Comparison

Comparison of CTI performance among different PCB materials

FR-4 is not a single material specification. Different laminate systems can provide very different CTI performance depending on resin chemistry, construction, and manufacturer formulation.

MaterialManufacturerTypical CTITypical Applications
S1600Shengyi≥600VAutomotive, industrial, high-voltage PCB
KB-6160CKingboard≥600VPower electronics and reliability-focused designs
370HRIsolaHigh CTI gradeHigh-reliability industrial and telecom applications
IT-180AITEQ≥400VIndustrial electronics and lead-free assembly
Standard FR-4VariousTypically 175V–250VGeneral electronics applications
Material Evaluation Tip

CTI should be evaluated together with Tg, Dk/Df, thermal performance, copper reliability, and stackup structure. Understanding prepreg and core interactions is important when selecting a reliable PCB material system.

8. How to Select the Right CTI Material

Selecting a PCB material with the correct CTI rating requires balancing electrical safety, environmental conditions, manufacturing requirements, and product cost.

Step 1: Identify Operating Environment

Determine whether the PCB will operate in a clean indoor environment or under conditions involving humidity, dust, chemicals, or temperature cycling.

Step 2: Define Voltage and Creepage Requirements

Evaluate working voltage, pollution degree, and required creepage distance according to the applicable safety standard. The selected CTI rating should support the required insulation design.

Step 3: Verify Laminate Datasheet

Never assume CTI performance based on material family names. Confirm the exact laminate grade, manufacturer specifications, and certification information before production.

Step 4: Consider Complete PCB Performance

CTI is only one part of material selection. Engineers should also consider thermal performance, signal integrity, assembly temperature, and mechanical reliability.

For complex PCB stackups, factors such as prepreg and core selection, surface finish compatibility, and manufacturing capability should be reviewed together.

PCB layout decisions such as spacing, via structures, and copper geometry should also be verified during design review. Related considerations include PCB annular ring design requirements.

9. Typical Tracking Failure Analysis

A common tracking-related failure occurs when a PCB designed for a controlled environment is later exposed to higher humidity, contamination, or electrical stress than originally expected.

Typical Failure Scenario

A high-voltage industrial PCB using standard FR-4 may experience leakage current growth when moisture and contaminants create a conductive surface path. Over time, carbonized tracking can develop and increase the risk of intermittent faults or permanent failure.

Corrective Actions

  • Select a higher CTI laminate suitable for the application environment.
  • Increase creepage distance where possible.
  • Use additional protection methods such as conformal coating when required.
  • Review the complete insulation system during PCB design.

Surface protection methods, including conformal coating and appropriate solder mask selection, should be considered as part of the complete reliability strategy rather than replacements for correct material selection.

10. Frequently Asked Questions

What CTI rating should I use for automotive PCB applications?

Automotive PCBs exposed to humidity, temperature cycling, and contamination commonly require higher CTI materials, often 400V or above. Under-hood and EV applications may require CTI ratings of 600V depending on voltage and safety requirements.

Not necessarily. FR-4 describes flame resistance performance, not a fixed CTI value. Standard FR-4 materials may have CTI values around 175V, while specialized high-CTI FR-4 materials can reach 600V or higher.

Higher CTI materials provide better resistance against surface tracking and may reduce required creepage distance under the same voltage and pollution conditions. However, clearance and other insulation requirements must still be considered.

Conformal coating can provide additional protection against moisture and contamination, but it should not automatically replace selecting the correct base material. The complete insulation system must meet application requirements.

IEC 60112 defines the test method used to determine CTI and PTI values for solid insulating materials under controlled contamination and electrical stress conditions.

By Jason Chu

A graduate in Automation Control, with 20+ years in PCB engineering, fabrication, assembly, and software/hardware testing. Handled projects for Fortune 500 companies such as IBM, Huawei, Samsung, Sony, Seagate, Schneider Electric and Toshiba, and brings extensive expertise in high-end electronics manufacturing.

Related Posts

PCB with Würth Elektronik 7461094 press-fit terminals and a magnified inset showing damage around the press-fit holes.

The dimensions of PCB press-fit holes directly affect the quality of component press-fit.

IPC Class 2 and Class 3 rigid PCB manufacturing requirements under IPC-6012
Engineering guide to IPC Class 2 and Class 3 rigid PCB manufacturing, including.

Leave a Reply

Your email address will not be published. Required fields are marked *